Patents Assigned to Cheng Shin Rubber Ind., Co., Ltd.
  • Patent number: 5186952
    Abstract: A mold including a pair of bodies engageable with each other and each including an annular recess, an annular groove and an annular depression, a ring being engaged in the annular recess and the annular groove respectively, and one or more rings corresponding to the tread portion of the tire being engaged in the annular depression of each of the bodies, a mold cavity for forming the tire being formed in the bodies and the rings, the rings engaged in the annular depressions being arranged in parallel with each other so that the rings can be stably and properly retained in place.
    Type: Grant
    Filed: November 20, 1991
    Date of Patent: February 16, 1993
    Assignees: Cheng Shin Rubber Ind., Co., Ltd., Ming King Ind., Co., Ltd.
    Inventors: Tsai J. Lo, David Hwang
  • Patent number: D882491
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: April 28, 2020
    Assignee: Cheng Shin Rubber Ind. Co., Ltd.
    Inventor: Hao-Hsieh Lin
  • Patent number: D959359
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: August 2, 2022
    Assignee: Cheng Shin Rubber Ind. Co., Ltd.
    Inventors: Yu-Ju Lee, Tsung-Hsien Shih, Li-Hao Yen
  • Patent number: D959360
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: August 2, 2022
    Assignee: Cheng Shin Rubber Ind. Co., Ltd.
    Inventors: Yu-Ju Lee, Li-Hao Yen
  • Patent number: D960078
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: August 9, 2022
    Assignee: Cheng Shin Rubber Ind. Co., Ltd.
    Inventors: Li-Hao Yen, Yu-Ju Lee
  • Patent number: D991149
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: July 4, 2023
    Assignee: Cheng Shin Rubber Ind. Co., Ltd.
    Inventor: Kuang-Hua Wu