Patents Assigned to CHENGDU YIJIAN MEDICAL TECHNOLOGY CO., LTD
  • Patent number: 11802925
    Abstract: A magnetic resonance imaging (MRI) system with low-power miniaturization, a power supply system, and a power management system are provided. The MRI system includes: a permanent magnet using samarium-cobalt material, an MR console, a transmission RF chain, a receiving RF chain, gradient coils, gradient amplifiers, and a terminal device for user interactions. Each of above systems is a ultra-light and ultra-low-power ultra-low field brain MRI system for highly accessible healthcare applications.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: October 31, 2023
    Assignee: CHENGDU YIJIAN MEDICAL TECHNOLOGY CO., LTD
    Inventors: Ruixing Zhu, Zhizun Zhang, Hangxuan Li
  • Patent number: 11740304
    Abstract: A computer-implemented magnetic resonance imaging method for subject with a metal implant, including steps of: S1: building an ultra-low field MR system with a field strength ranged from 10 to 100 mT; S2: setting sequences with optimized parameters of the ultra-low field MR system for minimizing the sensitivity to field distortion and improving SNR; S3: magnetic resonance imaging with the ultra-low field MR system using the sequences for the subject with a metal implant to obtain MR images; and S4: improving SNR of obtained MR images by deep learning based image reconstruction.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: August 29, 2023
    Assignee: CHENGDU YIJIAN MEDICAL TECHNOLOGY CO., LTD
    Inventors: Ruixing Zhu, Zhizun Zhang, Hangxuan Li
  • Patent number: 11543476
    Abstract: A conduction-cooled radiofrequency coil subsystem of MRI system with high signal-to-noise ratio imaging capability at low field and/or ultra-low field. The conduction-cooled RF coil subsystem includes a radiofrequency (RF) coil module having at least one RF instrumentation; a cryocooler; and a thermal conduction line thermally connected between the cryocooler and the RF instrumentation. The RF coil module further includes a housing defining a thermally insulated vessel for accommodating the RF instrumentation. The thermal conduction line is thermally coupled to the cryocooler which is located outside the housing of the RF coil module and the RF instrumentation in the thermally insulated vessel to conduction cool the RF instrumentation. The at least one RF instrumentation includes one or more of an RF transceiver coil, an RF receiver coil, an RF preamplifier and an RF electronics module.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: January 3, 2023
    Assignee: CHENGDU YIJIAN MEDICAL TECHNOLOGY CO., LTD
    Inventors: Mengye Lyu, Hangxuan Li