Patents Assigned to Chi Mei Communication Sytems, Inc.
  • Patent number: 7135943
    Abstract: A lumped-element diplexer formed in a multi-layered substrate includes a high-pass filter circuit, a low-pass filter circuit, and a ground plane, the elements of the filter circuits being disposed as follows: a first capacitor plate on a first layer of the substrate connected to a first port and a first inductor plate on a third layer, a second capacitor plate on a second layer of the substrate connected to the first inductor plate and a third capacitor plate on a fourth layer, the third capacitor plate in turn being connected to a second port. A fourth capacitor plate on a fifth layer of the substrate is connected to a second inductor plate on a seventh layer, the second inductor plate in turn being connected to the ground plane on a zeroth layer. A fifth capacitor plate on a sixth layer of the substrate is connected to a third port.
    Type: Grant
    Filed: July 11, 2004
    Date of Patent: November 14, 2006
    Assignee: Chi Mei Communication Sytems, Inc.
    Inventors: Yo-Shen Lin, Ko-Mai Li
  • Patent number: D704684
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: May 13, 2014
    Assignee: Chi Mei Communication Sytems, Inc.
    Inventors: Guo-Liang Yeh, Tzu-Cheng Yu, Po-Ching Huang