Patents Assigned to CHI MEI COOPERATION
  • POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERNS BY USING THE SAME
    Publication number: 20120287393
    Abstract: A positive photosensitive resin composition and a method for forming patterns by using the same are disclosed. The photosensitive resin composition comprises a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a dye (C) and a solvent (D). The novolac resin (A) includes a high-ortho novolac resin (A-1) that has ortho-ortho methylene bonding to all methylene bonding in a ratio of 18% to 25%, thereby exhibiting excellent temporal stability and forming patterns with high resolution.
    Type: Application
    Filed: April 26, 2012
    Publication date: November 15, 2012
    Applicant: CHI MEI COOPERATION
    Inventors: Chi-Ming LIU, Chun-An SHIH