Abstract: A light-emitting diode (LED) light bulb and an application thereof are described. The light-emitting diode light bulb comprises: a light-emitting diode light source module; a base, wherein the light-emitting diode light source module is disposed on the base; and a driver portion to drive the light-emitting diode light source module, comprising a rotation shaft, wherein the driver portion is connected to the base via the rotation shaft, such that the light-emitting diode light source module can rotate relative to the driver portion.

Abstract: A metal-organic chemical vapor deposition (MOCVD) apparatus is described. The MOCVD apparatus includes a reaction chamber, a rotation stand, a wafer susceptor, a heater and a shower head. The reaction chamber includes an opening. The rotation stand is disposed within the reaction chamber. The wafer susceptor is disposed on the rotation stand, and the wafer susceptor can rotate by the driving of the rotation stand. The wafer susceptor includes a plurality of polygon-shaped wafer pockets disposed on a surface of the wafer susceptor, and the polygon-shaped wafer pockets are suitable to correspondingly accommodate a plurality of wafers. The heater is disposed under the wafer susceptor and within the rotation stand. The shower head covers the opening of the reaction chamber and introduces a gaseous precursor toward the surface of the wafer susceptor.

Abstract: A metal-organic chemical vapor deposition (MOCVD) apparatus is described. The MOCVD apparatus includes a reaction chamber, a rotation stand, a wafer susceptor, a heater and a shower head. The reaction chamber includes an opening. The rotation stand is disposed within the reaction chamber. The wafer susceptor is disposed on the rotation stand, and the wafer susceptor rotates by rotating of the rotation stand. The wafer susceptor includes a plurality of wafer pockets of at least two different diameters disposed on a surface of the wafer susceptor and the wafer pockets are suitable to correspondingly carry a plurality of wafers. The heater is disposed under the wafer susceptor and within the rotation stand. The shower head covers the opening of the reaction chamber and applies a gaseous precursor toward the surface of the wafer susceptor.

Abstract: A light emitting diode (LED) device and the applications are provided, wherein the LCD device comprises a light emitting direction and a cross-section perpendicular to the light emitting direction, wherein the cross-section has a first height perpendicular to the light emitting direction and a light emitting area having a second height perpendicular to the light emitting direction, the second height is substantially shorter than 70% of the first height.

Abstract: A light-emitting diode (LED) structure and a method for manufacturing the same are described. The light-emitting diode structure includes a p-type electrode, a bonding substrate, a p-type semiconductor layer, an active layer, an n-type semiconductor layer, an epitaxial growth substrate and an n-type electrode. The bonding substrate is disposed on the p-type electrode. The p-type semiconductor layer is disposed on the bonding substrate. The active layer is disposed on the p-type semiconductor layer. The n-type semiconductor layer is disposed on the active layer. The epitaxial growth substrate is disposed on the n-type semiconductor layer, wherein the epitaxial growth substrate includes an opening penetrating the epitaxial growth substrate. The n-type electrode is disposed in the opening and is electrically connected to the n-type semiconductor layer.

Abstract: A light-emitting diode (LED) light bulb and an application thereof are described. The light-emitting diode light bulb comprises: a light-emitting diode light source module; a base, wherein the light-emitting diode light source module is disposed on the base; and a driver portion to drive the light-emitting diode light source module, comprising a rotation shaft, wherein the driver portion is connected to the base via the rotation shaft, such that the light-emitting diode light source module can rotate relative to the driver portion.

Abstract: A light-emitting diode (LED) light source module is described, comprising: a heat conduction substrate, wherein a surface of the heat conduction substrate includes a plurality of recesses; a plurality of light-emitting diode chips respectively disposed in the recesses; an insulation layer disposed on the surface of the heat conduction substrate outside of the recesses; an electric conduction layer disposed on the insulation layer, wherein the light-emitting diode chips are electrically connected to the electric conduction layer; and an encapsulation layer covering the light-emitting diode chips, the electric conduction layer and the insulation layer.

Abstract: A side view type light-emitting diode package structure, and a manufacturing method and an application thereof are described. The side view type light-emitting diode package structure includes a silicon base, a first and a second conductive leads and at least one light-emitting diode chip. The silicon base includes a first cavity defining a light-extracting surface of the package structure. The first and the second conductive leads are respectively disposed at least on a portion and another portion of the first cavity and extend to an outer surface of the silicon base. The first and the second conductive leads are electrically isolated from each other. The light-emitting diode chip includes a first and second electrodes electrically connected to the first and the second conductive leads respectively, wherein the surface on the outer side of the silicon base is substantially perpendicular to the light-extracting surface.

Abstract: A lead frame structure of a light emitting diode is disclosed. The lead frame structure comprises a bonding zone, two wing-shaped reflective surfaces, a first electrode lead, and a second electrode lead. The first electrode lead and the second electrode lead are respectively connected to the bonding zone. The bonding zone bonds the light emitting diode. The reflective surfaces are formed on both sides of the bonding zone. A predetermined angle is formed between the bonding zone and the wing-shaped reflective surfaces for reflecting the side light emitted from the light emitting diode towards a predetermined direction.

Abstract: A light-emitting diode and the manufacturing method thereof are disclosed. The manufacturing method comprises the steps of: sequentially forming a refraction dielectric layer, a bonding layer, an epitaxy structure and a first electrode on a permanent substrate, wherein the epitaxy structure comprises a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer stacked in sequence; and forming a second electrode on the portion surface of the second conductivity type semiconductor layer. Therefore the light-emitting diode is achieved.

Abstract: A backlight module and an application thereof are disclosed. The backlight module comprises at least one light source and a light guide plate. The light guide plate is disposed at one side of the light source, wherein the light guide plate has a reducing region formed at one side of the light guide plate and close to the light source. The thickness of the light guide plate in the reducing region is decreased with the increasing distance away from the light source. The backlight module is applicable to a liquid crystal display (LCD) apparatus.

Abstract: A light emitting diode (LED) device and the applications are provided, wherein the LCD device comprises a light emitting direction and a cross-section perpendicular to the light emitting direction, wherein the cross-section has a first height perpendicular to the light emitting direction and a light emitting area having a second height perpendicular to the light emitting direction, the second height is substantially shorter than 70% of the first height.

Abstract: A lead frame structure of a light emitting diode is disclosed. The lead frame structure comprises a bonding zone, two wing-shaped reflective surfaces, a first electrode lead, and a second electrode lead. The first electrode lead and the second electrode lead are respectively connected to the bonding zone. The bonding zone bonds the light emitting diode. The reflective surfaces are formed on both sides of the bonding zone. A predetermined angle is formed between the bonding zone and the wing-shaped reflective surfaces for reflecting the side light emitted from the light emitting diode towards a predetermined direction.