Abstract: A display having voltage-driven organic light-emitting pixel circuits. Each pixel circuit includes an organic light-emitting diode, a data writing circuit, a capacitor, three transistors, and a switch. The pixel circuit can compensate the threshold voltage variations of low temperature poly silicon thin film transistors. This increases the stability of the voltage-driven organic light-emitting pixel circuits, improves the uniformity of the luminance of the display, and provides a larger aperture ratio for the pixels.

Abstract: A pixel circuit includes a light emitting device, a storage device configured to represent a level of illumination, and a driving device used to drive the light emitting device. Configuring the storage device includes changing a voltage difference across the storage device to a level larger than a threshold voltage of the driving device. The driving device reduces driving of the light emitting device while the storage device is being configured. After the storage device has been configured, the driving device is permitted to drive the light emitting device to emit light having a luminance level corresponding to the level of illumination represented by the storage device.

Abstract: A backlight module includes a light-emitting unit, and a controller to receive a first control signal and generate a second control signal to control the light-emitting unit. The controller controls a frequency of the second control signal according to a duty cycle of the first control signal.

Abstract: A method of fabricating a bonding structure having compliant bumps includes first providing a first substrate and a second substrate. The first substrate includes first bonding pads. The second substrate is disposed on one side of the first substrate and includes second bonding pads and compliant bumps disposed thereon. The second bonding pads are opposite to the first bonding pads. Next, a non-conductive adhesive layer and ball-shaped spacers are formed between the first and the second substrates. Finally, the first substrate, the non-conductive adhesive layer, and the second substrate are compressed, such that the compliant bumps on the second bonding pads of the second substrate pass through the non-conductive adhesive layer and are electrically connected to the first bonding pads of the first substrate, respectively. The ball-shaped spacers are distributed in the non-conductive adhesive layer sandwiched between the first and the second substrates for maintaining the gap therebetween.

Abstract: A contact structure disposed on a substrate is provided. The contact structure includes at least one pad, at least one polymer bump and at least one conductive layer. The pad is disposed on the substrate and the polymer bump is disposed on the substrate. The polymer bump has a curved surface having a plurality of concave-convex structures. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.

Abstract: A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.

Abstract: A method for fabricating a display substrate is provided. A substrate is provided first. After that, an alignment film coating and an alignment treatment are performed to the substrate, and a layer of photoreactive monomer material is coated on the surface of the substrate after the alignment treatment. Thereafter, the layer of photoreactive monomer material is selectively irradiated by UV light in an exposed region, and the layer of photoreactive monomer material in an unexposed region is removed for liquid crystal molecules to have different pretilt angles in the exposed region and the unexposed region.

Abstract: A bonding structure including a first substrate, a second substrate, a non-conductive adhesive layer, and ball-shaped spacers is provided. The first substrate has first bonding pads. The second substrate is disposed on one side of the first substrate, and includes second bonding pads and compliant bumps disposed on the second bonding pads, respectively. The second bonding pads on the second substrate are electrically connected to the first bonding pads on the first substrate through the compliant bumps, respectively. The non-conductive adhesive layer is sandwiched between the first substrate and the second substrate. The ball-shaped spacers are distributed in the non-conductive adhesive layer to maintain the gap between the first and second substrates.

Abstract: A electrical connecting structure including a conductive pad, a polymer bump and a patterned conductive layer is provided. The conductive pad is on a substrate and the polymer bump is disposed over the substrate. The patterned conductive layer is disposed on the polymer bump and electrically connects to the conductive pad, wherein the patterned conductive layer covers a portion of the polymer bump and exposes another portion of the polymer bump.

Abstract: An etchant for patterning composite layer containing copper is provided. The etchant includes peracetic acid being about 5% to 40% by weight and serving as a major component, a peracetic acid stabilizer being about 5% to 15% by weight, an organic acid being about 5% to 10% by weight, an inorganic acid being about 5% to 15% by weight, a salt being about 8% to 15% by weight, which are based on the total weight of the etchant.

Abstract: A liquid crystal display includes a first substrate having a first electrode and a first alignment film, a second substrate having a second electrode and a second alignment film, and a liquid crystal layer having liquid crystal molecules between the first and second substrates. The liquid crystal layer is doped with a chiral material that tends to induce a twist in directors of the liquid crystal molecules when an electric field is applied to the liquid crystal layer using the first and second electrodes. The first alignment film has a first alignment direction, the second alignment film has a second alignment direction, and the first and second alignment films have orientations that tend to induce a twist in the directors when an electric field is applied to the liquid crystal layer, in which the direction of twist induced by the first and second alignment films is different from the direction of twist induced by the chiral material.

Abstract: A method of manufacturing an optical film includes steps of providing a substrate first and performing an alignment treatment on the surface of the substrate or forming an alignment layer on the substrate. A first liquid crystal layer is then coated on the aligned surface of the substrate or on the surface of the alignment layer, and thereafter, a first curing step is performed. After a second alignment layer is coated on the surface of the first liquid crystal layer, a second curing step is performed so as to form a multi-layer including the first and second liquid crystal layers.

Abstract: A displaying device at least comprises a thin film transistor (TFT); a first electrode controlled by the TFT; a first capacitor electrode and a second capacitor electrode electrically connected to each other through the first electrode. The first electrode has a first slit. The first slit is positioned between a first zone and a second zone, wherein the first zone connects the first capacitor electrode and the first electrode, and the second zone connects the second capacitor electrode and the first electrode. If a defect is observed, a portion of the first electrode is removed for isolating the first capacitor electrode and the second capacitor electrode.

Abstract: A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.

Abstract: An active matrix display is provided with conductor lines extending along edges of the display over the display substrate but outside the display area. These conductor lines include at least one layer which is additional to the thin film layers defining the array of pixels. Row driver circuitry and/or column driver circuitry has a portion provided on the common substrate outside the display area and which connects to the conductor lines. A dedicated process may be used for the conductor lines in order to form low resistance lines. These assist in the integration or mounting of row or column driver circuits onto the common substrate.

Abstract: A method of measuring image-sticking of a display device based on a vision model is described. A display device is provided, and a test frame is displayed on the display device. The test frame has a pattern formed by a maximum gray level and a minimum gray level. After burning-in the test frame for a period of time, a gray frame at a medium gray level is displayed on the display device. The test frame, including portions of extreme black and extreme white, leaves image-sticking on the gray pattern at a medium gray level at the same time. Next, an image capture device is used to capture the image-sticking on the display device after burn-in. Finally, a vision model is employed to simulate the human visual perception on the image-sticking and to grade the image-sticking according to the human eye sensitivity for viewing the image-sticking on the display device.

Abstract: A method for fabricating a thin film transistor (TFT) is provided. A substrate having a gate, a dielectric layer, a channel layer and an ohmic contact layer formed thereon is provided. Next, a metal layer is formed over the substrate covering the ohmic contact layer. Next, the metal layer and the ohmic contact layer are simultaneously etched by a wet etching process to form a source/drain and expose the channel layer. Because the wet etching process can be used to selectively etch the ohmic contact layer, damage to the underlying channel layer may be negligible. Thus, the reliability of the device may be promoted. Furthermore, the process may be simplified, the production yield and the throughput of TFT may be increased.

Abstract: A logic circuit includes a logic unit, a driving unit, and a voltage level adjuster. The logic unit includes an output node having a logic state, the logic unit being coupled to a first voltage reference. The driving unit includes an input node, the driving unit being coupled to a second voltage reference, the driving unit and the first logic unit being constructed from a single type of transistor. The voltage level adjuster provides a control signal that causes the driving unit to reduce a current flowing through the driving unit when the output node of the first logic unit has a first logic state, and causes the driving unit to drive an output node of the logic circuit to a voltage level substantially equal to that of the second voltage reference when the output node of the first logic unit has a second logic state.

Abstract: A display panel includes a first scanning band, a second scanning band, and a third scanning band positioned between the first scanning band and the second scanning band, and each scanning band includes a plurality of parallel scanning lines. The display panel further includes a plurality of parallel data lines extending across the first scanning band, the second scanning band, and the third scanning band. Each of the data lines includes a disconnecting point positioned in the third scanning band with a mosaic distribution.

Abstract: A display device, for example a liquid crystal display device (1), and driving method are provided that avoid the need to provide the display device with display data (e.g. video) containing individual display settings for each pixel. The display device comprises an array of pixels (21-36, 71a-79d, 121-136) and an array of processing elements (41-48, 71-79, 141-148), each processing element being associated with a respective pixel or group of pixels. The processing elements (41-48, 71-79, 141-148) perform processing of compressed input display data at pixel level. The processing elements (41-48, 71-79, 141-148) decompress the input data to determine individual pixel settings for their associated pixel or pixels. The processing elements (41-48, 71-79, 141-148) then drive the pixels (21-36, 71a-79d, 121-136) at the individual settings. A processing element may interpolate pixel settings from input data allocated to itself and one or more neighbouring processing elements.