Abstract: A switchboard copper busbar heat dissipating device for dissipating heat from a copper busbar inside a switchboard includes a thermally-conductive electrically-insulating plate having a first surface connected to the copper busbar and a second surface; at least one heat pipe having a first end connecting to the second surface of the thermally-conductive electrically-insulating plate and a second end protruding out of the switchboard; and a plurality of cooling fins connected to the second end of the heat pipe and disposed outside the switchboard. Hence, the switchboard copper busbar heat dissipating device is conducive to miniaturization of a switchboard, enhancement of efficiency of heat dissipation of the switchboard, compliance with the Ingress Protection (IP) Ratings of the switchboard (regarding waterproofing and dust-proofing thereof), and avoiding a waste of energy.