Abstract: A printing system includes a controller and a thermal printing head including multiple driving elements and an integrated transmission control interface. The thermal printing head is coupled to the controller. The driving elements are configured to print. The integrated transmission control interface coupled to the controller and driving elements is configured to receive from the controller at least one of a compensation data, a printing data, a clock signal, a data signal, a latch signal or a start-heating signal, and send to driving elements the at least one of the compensation data, the printing data, the clock signal, the data signal, the latch signal or the start-heating signal.

Abstract: A thermal print head structure includes a fixed electrode layer, a movable electrode layer opposite to the fixed electrode layer, a protection layer group covering the fixed electrode layer and the movable electrode layer, a heat source used to heat the fixed electrode layer, and a number of spacers. The fixed electrode layer includes a fixed electrode line. The movable electrode layer includes a flexible electrode line which is intersected with the fixed electrode line. These spacers are located between the fixed electrode layer and the protection layer group such that gaps are defined between the fixed electrode layer and the protection layer group. When a potential difference is generated between the fixed electrode line and the flexible electrode line, the movable electrode layer contacts the fixed electrode layer through the gap.

Abstract: The present invention relates to a method for manufacturing a thermal print head. Dispose a silicon substrate on a carrier, and dispose sequentially a glaze layer, a thermal resistance layer, an electrode pattern layer, and a passivation layer on the silicon substrate for forming a thermal print head. In addition, the size of the silicon substrate disposed on the carrier can be changed according to the opening on the carrier for providing a large-size thermal print head or one-time large-size printing.

Abstract: A method for continuously preparing organic light emitting diode (OLED) by using thermal transfer film is revealed. At least two thermal transfer layers are transferred onto a substrate in turn by thermal transfer printing for overcoming shortcomings of the conventional vacuum evaporation including complicated processes and low material efficiency. Only less than 50% material reaches the substrate after the vacuum evaporation.

Abstract: A dye receiving sheet includes a substrate and at least one dye receiving layer on one side of the substrate. The dye receiving layer includes: (a) polymers, wherein the polymers include PVC or PVC-VA copolymer or a mixture thereof, and the polymers are in an amount of 60-85 parts by weight based on the total weight of 100 parts by weight of the dye receiving layer; (b) a plasticizer, wherein the plasticizer has a melting point higher than 40° C., and the plasticizer is in an amount of 10-35 parts by weight based on the total weight of 100 parts by weight of the dye receiving layer; and (c) heat stabilizer, wherein the stabilizer is in an amount of 2-8 parts by weight based on the total weight of 100 parts by weight of the dye receiving layer.

Abstract: A method of fabricating organic light-emitting diode is disclosed, and the method includes the following steps. A first organic material region and a second organic material region are formed on a film. The first organic region is heated by a heat source such that the heated first organic material region is laminated on a substrate to form a first organic material layer. The film is between the heat source and the first organic material region. The second organic region is heated by the heat source such that the heated second organic material region is laminated on the first organic material layer to form a second organic material layer. The film is between the heat source and the second organic material region.