Abstract: A thin-film inductor device includes a substrate made of an electrically insulating material, a first coil unit, a second coil unit, and an inductance-enhancing structure. The first coil unit includes a first upper coil, a first lower coil, and two first electrodes electrically connected to the first upper and lower coils, respectively. The second coil includes a second upper coil, a second lower coil, and two second electrodes electrically connected to the second upper and lower coils, respectively. The first and second upper/lower coils are disposed spacedly and arranged by bifilar winding. The inductance-enhancing structure encapsulates the substrate, the first coil unit, and the second coil unit such that two terminal parts of each of the first electrodes and the second electrodes are exposed for external electrical connection.

Abstract: An inductive device and a method of manufacturing the same are provided. The inductive device includes a magnetic base, a coil structure, and a package structure. The magnetic base includes a bottom plate, a core column, and a lateral wall defining a positioning trench. The coil structure includes a coil body, a first extending section, and a second extending section. The coil body disposed in the positioning trench surrounds the core column. The first extending section includes a first bent portion and a first terminal portion connected at a first connecting point. The second extending section includes a second bent portion and a second terminal portion connected at a second connecting point. A shortest distance between a first imaginary connection line defined between the first and second connecting points and a central axis of the core column is less than a minimum outer radius of the coil body.

Abstract: An inductor and a power module are respectively provided. The inductor includes an insulating body and a conductive body. The insulating body has a top surface and a bottom surface. The conductive body includes two pin parts and a heat dissipation part. A portion of each of the pin parts is exposed outside the bottom surface. The portions of the two pin parts exposed outside the insulating body are configured to fix to a circuit board. The heat dissipation part is connected to the two pin parts, the heat dissipation part is exposed outside the top surface, and the heat dissipation part is configured to connect to an external heat dissipation member. When the inductor is fixed to the circuit board through the two pin parts exposed outside the bottom surface, the two pin parts and the bottom surface jointly define an accommodating space for accommodating a chip.

Abstract: An inductor manufacturing method includes making a coil with a wire member, the coil has two end portions, bending a dependent segment from one end portion of the coil, and bending a lateral extension from the dependent segment, bending a bent segment from the second end portion of the coil, and bending a lateral segment from the bent segment, a base member is then engaged into a space between the coil and the lateral extension and the lateral segment of the coil for forming a coil assembly, the coil assembly is then engaged into a mold cavity of a mold device and punched together with an iron powder, the lateral extension and the lateral segment of the coil are electroplated with an electroplating layer.

Abstract: An antenna structure includes a feeding layer, a resonation layer, and a ground layer. The feeding layer is configured for receiving an antenna feeding signal. The resonation layer is disposed at an area surrounding the feeding layer. A first predetermined distance is defined between the resonation layer and the feeding layer. The ground layer is disposed at a side of the feeding layer and the resonation layer. A second predetermined distance is defined between the ground layer and resonation layer. The ground layer includes a first support portion and a second support portion. The ground layer is not electrically connected to the feeding layer. The resonation layer is electrically connected to the first support portion and the second support portion of the ground layer.

Abstract: The present application relates to an alloy powder composition, a method for manufacturing a molding from the alloy powder composition, a molding obtained from the method, and an inductor comprising the molding. The alloy powder composition comprises an Fe-based amorphous alloy powder and an Fe-based crystalline alloy powder; wherein the Fe-based amorphous alloy powder has a volume resistivity of equal to or less than 1×106 ?·cm when subjected to a force of 20 kN and the Fe-based crystalline alloy powder has a volume resistivity of equal to or greater than 1×106 ?·cm when subjected to a force of 20 kN; and wherein the Fe-based amorphous alloy powder comprises Fe, Co, Cr, C, P, and Si.

Abstract: An inductor comprises a core member including a groove portion and a wire-winding portion. The groove portion extends through the wire-winding portion along the direction of the wire-winding axis, and the groove portion's cross-sectional area perpendicular to the wire-winding axis is in the range of from one-third to one-half of the core member's entire cross-sectional area perpendicular to the wire winding axis.

Abstract: An improved structure of inductor includes a C-shaped core and a prismatic strut core. The C-shaped core has two extended portions and a side portion that has its two ends connected to a fixed end of each of the extended portions. The prismatic strut core has a bottom surface, a top surface, and a number of side surfaces that are wound around by a coil. The prismatic strut core inserts and places between the two extended portions with the coil pressed against the side portion. When it comes to assembling, all one has to do is to place the prismatic strut core into the C-shaped core and has adhesive to glue the coil to the side portion to complete the fabrication of the inductor in order to prevent the coil from being loose and come off.

Abstract: Flux compositions for sintering Ni—Zn ferrite material are disclosed in the present invention, each flux composition basically and selectively has zinc oxide (ZnO), silicon dioxide (SiO2), boric oxide (B2O3), bismuth trioxide (Bi2O3), aluminum oxide (Al2O3), potassium trioxide (K2O3), barium oxide (BaO), sodium oxide (Na2O), calcium oxide (CaO), and magnesium oxide (MgO). Each flux composition is added into a mixture of Ni—Zn ferrite material composed of ferric oxide (Fe2O3), nickel oxide (NiO), zinc oxide (ZnO), cupric oxide (CuO) and cobalt oxide (CoO) and ranges from 0.05 to 10 weight percent based on the total weight of the Ni—Zn ferrite material. The flux compositions of the present invention decrease sintering temperature when the ferrite material is sintered and contain no lead (Pb) element so as to reduce toxic pollutants.