Patents Assigned to China Chippacking Technology Co. Ltd.
  • High density integrated circuit package structure and integrated circuit
    Patent number: 9768101
    Abstract: The present invention relates to the technical field of integrated circuit package, and more specifically, this invention relates to a high density integrated circuit package structure and an integrated circuit with this package structure. A high density integrated circuit package structure according to this invention comprises a sealed metal lead frame, a chip, and a cuboid plastic package structure with micron connecting wires. The length (A1) of the plastic package structure meets the relationship 1.20 mm+(B?8)×0.3 mm/2?A1?4.50 mm+(B?8)×1.00 mm/2, the width (A2) of the plastic package structure meets the relationship 1.20 mm?A2?3.50 mm, the thickness (A3) of the plastic package structure meets the relationship A3?0.35 mm, and B is the number of the outer leads and is an integer number meeting the relationship 4?B?68. A package structure according to this invention may meet the demands generated when chip manufacturing technology progresses from micron scale to sub-micron scale, or even nanometer scale.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: September 19, 2017
    Assignee: China Chippacking Technology Co. Ltd.
    Inventor: Dazhong Liang
  • HIGH DENSITY INTEGRATED CIRCUIT PACKAGE STRUCTURE AND INTEGRATED CIRCUIT
    Publication number: 20170207149
    Abstract: The present invention relates to the technical field of integrated circuit package, and more specifically, this invention relates to a high density integrated circuit package structure and an integrated circuit with this package structure. A high density integrated circuit package structure according to this invention comprises a sealed metal lead frame, a chip, and a cuboid plastic package structure with micron connecting wires. The length (A1) of the plastic package structure meets the relationship 1.20 mm+(B?8)×0.3 mm/2?A1?4.50 mm+(B?8)×1.00 mm/2, the width (A2) of the plastic package structure meets the relationship 1.20 mm?A2?3.50 mm, the thickness (A3) of the plastic package structure meets the relationship A3?0.35 mm, and B is the number of the outer leads and is an integer number meeting the relationship 4?B?68. A package structure according to this invention may meet the demands generated when chip manufacturing technology progresses from micron scale to sub-micron scale, or even nanometer scale.
    Type: Application
    Filed: September 8, 2016
    Publication date: July 20, 2017
    Applicant: China Chippacking Technology Co. Ltd.
    Inventor: Dazhong LIANG