Patents Assigned to CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 44 RESEARCH INSTITUTE
  • Patent number: 11984894
    Abstract: A system and a method for generating an arbitrary waveform of a microwave photon based on optical frequency tuning are provided. The system includes an optical frequency comb, a first optical distribution unit, a first photoelectric conversion unit, a frequency-shift drive circuit, and an optical frequency doubling/dividing unit, an optical frequency-shift combining optical circuit, a second photoelectric conversion unit, and a second electrical processing circuit. The optical frequency comb is used as the frequency source, with the features of high stability and low phase noise of the optical frequency comb, the arbitrary waveforms of microwave photons can be generated through optical frequency tuning control; the performance of the optical frequency comb is three orders of magnitude or more higher than that of the common microwave frequency sources, therefore, the waveforms with high-frequency, ultra-wideband, low phase noise, and high stability can be generated.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: May 14, 2024
    Assignee: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO 44 RESEARCH INSTITUTE
    Inventors: Hao Zhang, Yongchuan Xiao, Caibin Yu, Xu Liang, Lijun Sun
  • Publication number: 20240107204
    Abstract: The disclosure provides a microwave photon frequency synthesis system and method. In the disclosure, based on various combinations of path switching options of optical routing modules and electrical routing modules, the microwave photon frequency synthesis system is provided with a direct photoelectric conversion mode, an electrical frequency synthesis mode and an optical amplitude and phase control mode. The first optical signal frequency selection based on the optical frequency comb module and the frequency multiplication/division selection of the optical frequency multiplication/division module can be freely combined to realize frequency sources of various frequencies. Based on the optical frequency comb module to generate the first optical signal, and then combined with an electrical filtering module, phase noise can be reduced. The optical amplitude and phase may be controlled by the optical amplitude and phase control module.
    Type: Application
    Filed: September 17, 2023
    Publication date: March 28, 2024
    Applicant: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.44 RESEARCH INSTITUTE
    Inventors: Hao ZHANG, Xuan LI, Maoxu WANG, Yongchuan XIAO, Yu ZHANG
  • Patent number: 11936433
    Abstract: The present disclosure relates to the field of microwave and optoelectronic technologies, and in particular to an integrated microwave photon transceiving front-end for a phased array system, including: a ceramic substrate, on which a control integrated circuit, a silicon-based photonic integrated chip, a first amplifying chipset, a second amplifying chipset, and a microwave switch chipset are carried. The control integrated circuit is configured to control the silicon-based photonic integrated chip and the microwave switch chipset by means of an input control signal. The silicon-based photonic integrated chip is connected at one end with an input/output optical fiber, and at the other end with the first amplifying chipset and the second amplifying chipset. The two amplifying chipsets are connected to the microwave switch chipset respectively, and the microwave switch chipset is further connected with a phased array antenna.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: March 19, 2024
    Assignee: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 44 RESEARCH INSTITUTE
    Inventors: Yu Zhang, Xu Liang, Jing Xu, Lijun Sun
  • Patent number: 11641533
    Abstract: The present invention belongs to the technical field of CMOS image sensors, and particularly relates to an on-chip multiplexing pixel control circuit for controlling a super-large area array splicing CMOS image sensor. The multiplexing type pixel control circuit includes at least one multiplexing unit, each multiplexing unit includes L levels of serial pixel control sub-circuits and a windowing address gating circuit. Through the different positions of the multiplexing units in the whole chip, the group address buffer circuits of the multiplexing units generate different group address reference signals, which are compared with a group decoding address generated in a group decoding address buffer circuit to realize group decoding and gate the multiplexing unit. Meanwhile, the serial pixel control sub-circuit in the multiplexing unit is compared with a row decoding address to realize exposure and readout control of a corresponding row of the multiplexing unit.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: May 2, 2023
    Assignee: China Electronics Technology Group Corporation No.44 Research Institute
    Inventors: Zhijun Wu, Changju Liu, Yiqiang Li
  • Publication number: 20230008212
    Abstract: The present disclosure relates to the field of microwave and optoelectronic technologies, and in particular to an integrated microwave photon transceiving front-end for a phased array system, including: a ceramic substrate, on which a control integrated circuit, a silicon-based photonic integrated chip, a first amplifying chipset, a second amplifying chipset, and a microwave switch chipset are carried. The control integrated circuit is configured to control the silicon-based photonic integrated chip and the microwave switch chipset by means of an input control signal. The silicon-based photonic integrated chip is connected at one end with an input/output optical fiber, and at the other end with the first amplifying chipset and the second amplifying chipset. The two amplifying chipsets are connected to the microwave switch chipset respectively, and the microwave switch chipset is further connected with a phased array antenna.
    Type: Application
    Filed: April 22, 2020
    Publication date: January 12, 2023
    Applicant: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 44 RESEARCH INSTITUTE
    Inventors: Yu ZHANG, Xu LIANG, Jing XU, Lijun SUN
  • Publication number: 20220311963
    Abstract: The present invention belongs to the technical field of CMOS image sensors, and particularly relates to an on-chip multiplexing pixel control circuit for controlling a super-large area array splicing CMOS image sensor. The multiplexing type pixel control circuit includes at least one multiplexing unit, each multiplexing unit includes L levels of serial pixel control sub-circuits and a windowing address gating circuit. Through the different positions of the multiplexing units in the whole chip, the group address buffer circuits of the multiplexing units generate different group address reference signals, which are compared with a group decoding address generated in a group decoding address buffer circuit to realize group decoding and gate the multiplexing unit. Meanwhile, the serial pixel control sub-circuit in the multiplexing unit is compared with a row decoding address to realize exposure and readout control of a corresponding row of the multiplexing unit.
    Type: Application
    Filed: April 22, 2020
    Publication date: September 29, 2022
    Applicant: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 44 RESEARCH INSTITUTE
    Inventors: Zhijun WU, Changju LIU, Yiqiang LI