Abstract: A plunger machine for molding reinforced polymer is provided. The plunger machine has particular application in molding polymer that is reinforced with particles having an aspect ratio greater than 1:1. The plunger machine includes a barrel housing with a smooth barrel bore that defines a main melt chamber. A plunger housing, having a plunger bore, defines an initial melt chamber that is in communication with the main melt chamber. A plunger resides in the plunger bore and is reciprocatable therein. The barrel bore is continuously inwardly to provide a smooth transition and alignment of reinforcing members in the polymer mixture during the melt process. The smooth bore ensures substantial alignment of the reinforcement members with the longitudinal axis of the bore to avoid excessive breakage of the reinforcing particles and prepare the polymer mixture for extrusion into a mold assembly.

Abstract: A heat sink assembly for removing heat from multiple semiconductor device packages is disclosed. The heat sink assembly includes a circuit board where a first semiconductor device package is installed on the circuit board. A second semiconductor device package is installed on the circuit board. A support plate is positioned over the upper surface of said first semiconductor device and over the upper surface of the second semiconductor device. The support plate includes two threaded bores corresponding to the positioning and layout of the first and second semiconductor devices. The support plate is, preferably, secured relative to the first semiconductor device and said second semiconductor device by a clip on one side of the support plate and a pair of threaded fasteners on the opposing end.

Abstract: A conductive net-shape moldable molding composition, with a thermal conductivity above 22 W/m°K and a volume electrical resistivity of 0.1 ohm-cm or lower and a surface electrical resistivity of 1.0 ohm or lower, is provided. The thermally and electrically conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.

Abstract: A method of forming a phase change passive heat sink, with a base member and heat dissipating members, is provided. The base member is hollow and defines an evaporation chamber therein. A number of heat dissipating members are connected to the base member. Each of the heat dissipating members are substantially tubular in configuration with a closed end and an open end and defining respective condensation chambers therein. The open ends of the heat dissipating members are connected to the base member with the condensation chambers and are in fluid communication with the evaporation chamber. A heat transporting media resides in the base member which is movable into the condensation chambers upon application of heat to the base member. Heat is dissipated through the heat dissipating members.

Abstract: A method of molding a reinforced article for optimizing heat transfer, electrical conductivity and/or structural integrity is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The desired positioning of the filler within the molded article is determined according to the thermal, electrical or structural needs of the article. An input gate and output gate vent is formed in the mold assembly to ensure positioning of the filler as desired. Polymer, loaded with reinforced filler, is introduced into the mold assembly via the input gate. Polymer is positioned in the mold assembly with the reinforcing filler being substantially parallel and aligned with the flow path. Finally, the molded article is ejected from the mold assembly. With the molding method of the present invention, thermal and electrical conductivity and structural integrity of articles may be increased several times over articles molding with conventional molding methods.

Abstract: A heat sink assembly, having a number of mounting holes therethrough, is installed on a heat generating surface of an electronic component for removing heat therefrom. A heat dissipating member having a base portion having a bottom surface and an upper surface with heat dissipating elements connected thereto is provided. The bottom surface is adapted to be matable in flush thermal communication with a heat generating surface of an electronic component. A cam assembly includes a support body as well as a connection body that is pivotally connected thereto about a pivot axis. At least one leg is connected to the support body with a retention member on its free end. The leg is routed through a selected one of the base apertures and one of the mounting holes corresponding thereto.

Abstract: A method of molding a thermally conductive article for transferring heat from a heat generating surface is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The initial location of contact on the article with the heat generating surface is then determined. An input gate is formed in the mold assembly at the initial location of contact. The optimum heat flow path through the article is determined. A termination location of the heat flow path is determined. Polymer, loaded with conductive filler, is introduced into the mold assembly via the input gate. Venting is provided in the mold assembly at the termination location of the heat flow path. Polymer is positioned in the mold assembly with the conductive filler being substantially parallel and aligned with the heat flow path. Finally, the molded article is ejected from the mold assembly.

Abstract: An molded heat sink assembly includes an integrally molded attachment clip for securing the assembly to a semiconductor package to be cooled. The assembly removes heat from a semiconductor device package having opposing side wall edges. The heat sink assembly also includes a heat conductive base member having a substantially flat bottom surface adapted to be positioned in flush thermal communication with a heat generating semiconductor device package. A number of heat dissipating elements are connected to and extend upwardly from the thermally conductive base member. A pair of semiconductor package engaging clips downwardly depend from and are integrally connected to opposing sides of the heat conductive base member. The engaging clips are disposed in gripping communication with respective opposing side wall edges of the semiconductor device package.

Abstract: A heat sink assembly, having a number of mounting holes therethrough, is installed on a heat generating surface of an electronic component for removing heat therefrom. A retaining clip has a central member and a number of legs which depending downwardly from the central member with ends of the legs not connected to the central member being free ends. Retention members are provided on each of the free ends of the legs to prevent the legs from being removed from their respective mounting holes. A heat dissipating member, having a threaded base portion is threadably received in a bore in the central member so that the flat bottom surface of the heat dissipating member is in flush thermal communication with the electronic component while the legs are secured within their respective holes in the electronic component.

Abstract: A conductive molding composition, with a thermal conductivity above 22 W/m.degree. K., is provided. The thermally conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.

Abstract: A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region and installed in a socket, is provided. A clip member is provided with a central female-threaded bore. A collar, having outer male threads and inner female threads is threadably receivable within the bore of the clip member. The collar is threaded down into the bore to communicate with an upper surface of the ceramic portion of a semiconductor device at a first pressure which is high enough to maintain the package in electrical communication with its socket. A heat dissipating member, having a male-threaded base, is threadably installed into the female-threaded bore of the collar to engage the upper surface of the silicon portion of the semiconductor package.

Abstract: A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured to the ceramic portion of the semiconductor package via a number of fasteners. A heat dissipating member, having male-threaded base, is threadably inserted into the female-threaded bore to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member is independently adjustable relative to the attachment pressure of the top member onto the ceramic portion of the semiconductor package. As a result, the multiple pressure requirements of the semiconductor package can be accommodated in a single heat dissipating device.

Abstract: A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured, without the use of tools, to the ceramic portion of the semiconductor package by a pair of upwardly standing legs with inwardly turned flanges where the flanges engage the marginal opposing portions of the top member. A heat dissipating member, having male-threaded base, is threadably inserted into the female-threaded bore to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member is independently adjustable, by hand, relative to the preset pressure of the top member onto the ceramic portion of the semiconductor package.

Abstract: A heat sink assembly with an adjustable and customizable mounting clip is provided. The length of the mounting clip can be precisely adjusted to accommodate integrated circuit device sockets of varying lengths. Unused legs of the mounting clip can be completely removed to accommodate neighboring circuit board components. With the mounting clip adjusted and legs selected, a heat sink member is threaded through the top planar member of the mounting clip into flush thermal communication with the top surface of an integrated circuit device to effectuate heat dissipation therefrom.

Abstract: A heatsink assembly with an adjustable retaining clip is provided. A heatsink member is retained in flush communication with an electronic device package by securing a retaining clip over the heatsink member into communication with the marginal portions of the electronic device package. An adjustment member is provided through the top wall of the retaining clip to adjustably control the pressure and tension of the flush communication between the heatsink member and the electronic device package. A channel in the heatsink member may be provided for recessed installation of the retaining clip to permit unrestricted installation of a fan on the top of the heatsink.

Abstract: A heat sink assembly with an adjustable and customizable mounting clip is provided. The legs of the mounting clip are adjustable to accommodate heat sink members of different sizes and shapes. The overall height of the mounting clip is adjustable by selecting a particular radial flange for mounting to a flange seat on a universal top member. With the leg length selected, unwanted portions of the legs may be snapped off and discarded to leave a customized, low-profile heat sink assembly.

Abstract: A article with interior interrupted threads and a mold apparatus for manufacturing the same is provided. The molded article includes an aperture positioned completely therethrough as defined by an inner wall. The inner aperture wall carries a series of thread segments positioned about the periphery of the inner wall to form an interrupted helical thread line. The thread segments create a female threaded aperture through the molded article for receipt of a male threaded member therein. The mold apparatus includes an upper half and a lower half. The upper half carries a cylindrical wall which is notched with its upper edge being beveled outwardly. The bottom half also carries a cylindrical wall which is notched as well as beveled outwardly.

Abstract: A article with interior interrupted threads and a mold apparatus for manufacturing the same is provided. The molded article includes an aperture positioned completely therethrough as defined by an inner wall. The inner aperture wall carries a series of thread segments positioned about the periphery of the inner wall to form an interrupted helical thread line. The thread segments create a female threaded aperture through the molded article for receipt of a male threaded member therein. The mold apparatus includes an upper half and a lower half. The upper half carries a cylindrical wall which is notched with its upper edge being beveled .outwardly. The bottom half also carries a cylindrical wall which is notched as well as beveled outwardly.