Abstract: This invention discloses a cell forming part of a customizable logic array device, the cell including at least first (34) and second multiplexers, each having a select input and an output, at least two inverters (42, 52), each having an input and an output, and electrical connections (26, 54), selectably connecting the output of the first multiplexer to either the select input of the second multiplexer or to the at least two inverters. A customizable logic array device including a plurality of cells, each cell including at least first and second multiplexers is also disclosed. The invention additionally discloses a cell forming part of a customizable logic array device, the cell including a pair of identical logic portion located on opposite sides of a driver portion. The driver portion includes at least two drivers, each having an input and an output.

Abstract: A customizable integrated circuit including a substrate, a plurality of logic units formed on the substrate and a plurality of metal routing layers formed on the substrate for interconnecting the plurality of logic units. The plurality of metal routing layers includes a first routing layer including a plurality of elongate conductors extending generally in a given direction, a second routing layer including a plurality of transversely extending conductors, each adapted for interconnecting a termination of one of the plurality of elongate conductors to a beginning of another one of the plurality of elongate conductors and at least a third routing layer, including a plurality of local routing conductors, a plurality of customizable connections between pairs of the plurality of elongate conductors via individual ones of the plurality of transversely extending conductors and customizable connections between individual elongate conductors and a plurality of individual local routing conductors.

Abstract: A customizable integrated circuit including a plurality of electrically conducting routing layers formed on a substrate for interconnecting a plurality of logic units formed on the substrate, including a first routing layer including a plurality of elongate conductors extending generally in a given direction, a second routing layer including a plurality of transversely extending conductors, each adapted for interconnecting a termination of one of the plurality of elongate conductors to a beginning of another one of the plurality of elongate conductors; and at least a third routing layer including a plurality of local routing conductors, a plurality of customizable connections, preferably arranged generally in at least one row, between pairs of the plurality of elongate conductors via individual ones of the plurality of transversely extending conductors and, preferably, customizable connections between individual ones of the plurality of elongate conductors and a plurality of individual ones of the local routi

Abstract: This invention discloses a cell forming part of a customizable logic array device, the cell including at least first and second multiplexers, each having a select input and an output, at least two inverters, each having an input and an output, and electrical connections, selectably connecting the output of the first multiplexer to either the select input of the second multiplexer or to the input of one of the at least two inverters. A customizable logic array device including a plurality of cells, each cell including at least first and second multiplexers is also disclosed.

Abstract: This invention discloses an integrated circuit device including transistors having predetermined upper voltage limits, a multi-layer metal interconnect structure connecting the transistors to each other and to an external voltage source having a voltage in excess of the predetermined upper voltage limits of a first plurality of the transistors, and a voltage reducer connected along the interconnect structure between the external voltage source and the first plurality of the transistors.

Abstract: A customizable gate array device including a customizable gate array portion and a customizable memory portion.

Abstract: This invention discloses a gate array device, useful either as a configurable gate array device or a compact gate array device, comprising an array of two-gate logic cells arranged in columns, a metal grid interconnecting said logic cells into clusters of macrocells, said grid comprising a bottom metal layer and at least one metal layer disposed over the bottom metal layer, power and ground lines formed of said bottom metal layer, extending generally parallel to said columns and a routing grid interconnecting said clusters of macrocells, said routing grid comprising parallel metal tracks crossing said columns of logic cells, and wherein no more than two of said parallel metal tracks are employed to connect to each logic cell.

Abstract: A very high speed customizable logic array device comprising:a substrate having at least one gate layer and at least first, second and third metal layers formed thereon, the gate layer including a multiplicity of identical unit logic cells,the customizable logic array device including at least three of the following functionalities:NAND, NOR, inverter, AND and ORand further being characterized in that the ratio between the rise time and the fall time of the logic cells embodying each of the at least three functionalities is constant.

Abstract: A cell forming part of a customizable logic array and including at least first and second different multiplexers, an output of the first multiplexer being connected to an input of the second multiplexer.

Abstract: Three metal layer customizable gate array devices and techniques to customize them are disclosed. Such a device incorporates an integrated circuit blank having a plurality of transistors and at least three metal layers. A plurality of fusible links interconnects said plurality of transistors into an inoperable circuit. A laser ablative etch resistant coating is formed over the device. Later, the coating is ablated by laser at locations overlaying designated fuse locations. The device is then etched for selectably removing some of the fusible links, thereby converting the inoperable integrated circuit blank into an operable gate array device.

Abstract: Customizable semiconductor devices, integrated circuit gate arrays and techniques to produce same are disclosed. The devices comprise integrated circuit blanks having a collection of semiconductor elements and at least one metal layer including fusible links interconnecting said collection of semiconductor elements into an inoperably connected integrated circuit blank. At least one metal layer is first etched thereby to define a pattern of conductors. A passivation layer is provided over at least one metal layer, afterwhich at least one metal layer is etched a second time for selectably removing the fusible links, thereby converting the inoperable integrated circuit blank into a selected operable electronic function.

Abstract: This invention discloses a gate array device, useful either as a configurable gate array device or a compact gate array device, comprising an array of two-gate logic cells arranged in columns, a metal grid interconnecting said logic cells into clusters of macrocells, said grid comprising a bottom metal layer and at least one metal layer disposed over the bottom metal layer, power and ground lines formed of said bottom metal layer, extending generally parallel to said columns and a routing grid interconnecting said clusters of macrocells, said routing grid comprising parallel metal tracks crossing said columns of logic cells, and wherein no more than two of said parallel metal tracks are employed to connect to each logic cell.