Abstract: A process for providing a temporary, non-intrusive electrical connection to bond pads of a semiconductor die permitting test and burn-in of bare die. Modified tape automated bonding (TAB) techniques are used with gold bumped die bond pads for providing known good die (KGD). After test and burn-in, the temporary connection to the die is removed without the need to reform the gold bumps prior to use in a multichip module. Gold inner leads of a TAB tape are diffusion bonded to gold bumps wherein the bonding is sufficient for providing electrical connection during the testing and burn-in of the die yet sufficiently weak for removal of the leads from the die after testing and burn-in. The process provides the KGD necessary for acceptable first assembly yields and long term reliability of multichip modules (MCM). Bare die with gold bumped, sealed bond pads are provided simplifying interconnection during testing and ultimate module use.

Abstract: A fuzzy data comparator receives a fuzzy data digital data bit stream and compares each frame thereof with multiple sets of differing known data stored in a plurality of pattern memories, using a selected comparison metric. The results of the comparisons are accumulated as error values. A first neural postprocessing network ranks error values less than a preselected threshold. A second neural network receives the first neural network solutions and provides an expansion bus for interconnecting to additional comparators.

Abstract: A constant current source is provided to charge a reference capacitor. The current is switched to the capacitor by a first high-speed analog switch when a first event occurs and the current is turned off by a second high-speed analog switch when a second event occurs. The voltage produced by the charge on the capacitor is proportional to the time between events. A sample and hold circuit maintains the maximum voltage on the capacitor when the events are periodic.