Patents Assigned to CHIP TECHNOLOGY CO., LTD
  • Patent number: 11962299
    Abstract: The present disclosure relates to a fractional frequency divider, a radio frequency transceiver, and a method of configuring a phase delay in the fractional frequency divider. The fractional frequency divider comprises a counter, a multiplexer, and a delay module. The method is applicable to the fractional frequency divider. The radio frequency transceiver comprises the fractional frequency divider, and the fractional frequency divider adopts the method. According to the aforesaid technical solution, the present disclosure has advantages as follows: the embodiments of the present disclosure can minimize the timing inaccuracy and suppress the output jitter and output spurs; and the embodiments of the present disclosure can effectively extend the operating frequency range of the fractional frequency divider.
    Type: Grant
    Filed: August 3, 2023
    Date of Patent: April 16, 2024
    Assignee: Hangzhou Geo-chip Technology Co., Ltd.
    Inventors: Yanping Zhou, Ruili Wu, Chun Geik Tan
  • Patent number: 11947972
    Abstract: Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 2, 2024
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Meng Yan, Omar Mahmoud Afdal Alnaggar, Myron O. Shak, Soheil Gharahi, William Kelsey
  • Patent number: 11876543
    Abstract: The present disclosure provides a mixer circuit, a transmitter, and a communication device. The mixer circuit comprises an I-channel digital-to-analog converter, a Q-channel digital-to-analog converter, a low-pass filter, and a passive quadrature mixer, wherein the low-pass filter comprises an active device, so that an output admittance of the mixer circuit contains conductance dependent of frequency. The consistency between the gains of the mixer circuit at the upper sideband and the lower sideband can be improved.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: January 16, 2024
    Assignee: Hangzhou Geo-chip Technology Co., Ltd.
    Inventor: Sy-Chyuan Hwu
  • Patent number: 11728909
    Abstract: Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: August 15, 2023
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Jawad Nasrullah, Omar Alnaggar, Hanfeng Wang, Mohamed Sameh Mahmoud
  • Patent number: 11720729
    Abstract: Described is a method comprising a processing, an establishing, and/or a determining. In the processing, an inputted capabilities list including one or more hardware design capabilities may be processed. In the establishing, one or more candidate components for the one or more hardware design capabilities may be established. In the determining, a set of unique candidate netlists capable of satisfying the one or more hardware design capabilities may be determined, the set of unique candidate netlists being based upon the set of candidate components.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: August 8, 2023
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Danielle Morton, Rick Yan
  • Patent number: 11689227
    Abstract: A broadband power amplifier device includes an input matching network including first, second and third inductors, a driver amplifier, and first, second and third frequency modulators. First inductor has one end connected to output of a mixer and the other end connected to one end of the first frequency modulator, with the other end of the first frequency modulator being grounded. The second inductor has one end connected to one end of first inductor and the other end connected to input of driver amplifier, with second frequency modulator being connected across second inductor. Third inductor has one end connected to output of driver amplifier and the other end connected to input of power amplifier, with third frequency modulator being connected across third inductor. Bandwidth of power amplifier device can be extended and area and current consumption thereof can be reduced, while power can be improved without large LO driver.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: June 27, 2023
    Assignee: HANGZHOU GEO-CHIP TECHNOLOGY CO., LTD.
    Inventor: Sy-Chyuan Hwu
  • Patent number: 11646706
    Abstract: A common-source differential power amplifier comprises a compensation circuit, which comprises a first and a second compensation transistors and two signal terminals, a source and a drain of the first compensation transistor are short-circuited and connected to a gate of the second compensation transistor and one signal terminal of the compensation circuit, the source and the drain of the second compensation transistor are short-circuited and connected to the gate of the first compensation transistor and the other signal terminal of the compensation circuit, the two signal terminals of the compensation circuit are further respectively connected to two differential signal input terminals of the common-source differential power amplifier directly or via a capacitor, where the first and second compensation transistors in the same compensation circuit are both NMOS transistors or both PMOS transistors. An electronic device including the power amplifier is also disclosed.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: May 9, 2023
    Assignee: Hangzhou Geo-chip Technology Co., Ltd.
    Inventor: Sy-Chyuan Hwu
  • Publication number: 20230124949
    Abstract: Described herein are mechanisms and methods for blocking the propagation of signals to Integrated Circuit (IC) components that have been power gated, rather than simply suffering from leakage through signals that might not be parked in a low state. In some embodiments, switches that block the flow of current in such signals may enable turning off power to any IC component and not just to circuits on an IC component that make sole use of protocols that are friendly to power gating. This may advantageously increase power savings, by permitting more portions of a system in an idle state to be power gated, or by reducing or eliminating leakage in signals on boundaries of blocks being power gated, or both.
    Type: Application
    Filed: December 15, 2022
    Publication date: April 20, 2023
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventor: Mathew Salazar
  • Patent number: 11573623
    Abstract: Described herein are mechanisms and methods for blocking the propagation of signals to Integrated Circuit (IC) components that have been power gated, rather than simply suffering from leakage through signals that might not be parked in a low state. In some embodiments, switches that block the flow of current in such signals may enable turning off power to any IC component and not just to circuits on an IC component that make sole use of protocols that are friendly to power gating. This may advantageously increase power savings, by permitting more portions of a system in an idle state to be power gated, or by reducing or eliminating leakage in signals on boundaries of blocks being power gated, or both.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: February 7, 2023
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventor: Mathew Salazar
  • Patent number: 11522567
    Abstract: Provided are a matching network, an antenna circuit and an electronic device. The matching network includes a first inductor, a second inductor, and a third inductor, the first inductor having two ends serving as a pair of output terminals, the second inductor having two ends serving as a first pair of input terminals, and the third inductor having two ends serving as a second pair of input terminals, where a first coupling coefficient between the first inductor and the second inductor is greater than a second coupling coefficient between the first inductor and the third inductor. According to the matching network, the matching network can present a rather large resistance value conversion ratio even with a rather small area taken by inductors, the circuit design can be more flexible, and the signal interference can be lowered.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: December 6, 2022
    Assignee: Hangzhou Geo-Chip Technology Co., Ltd.
    Inventor: Sy-Chyuan Hwu
  • Patent number: 11476182
    Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: October 18, 2022
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Zhiquan Luo, Jawad Nasrullah, Omar Mahmoud Afdal Alnaggar
  • Publication number: 20220329245
    Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.
    Type: Application
    Filed: June 28, 2022
    Publication date: October 13, 2022
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Meng Yan, Omar Mahmoud Adfal Alnagger, Myron O. Shak, Soheil Gharahi
  • Publication number: 20220319967
    Abstract: Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Zhiquan Luo, Jawad Nasrullah, Omar Mahmoud Afdal Alnaggar
  • Patent number: 11462904
    Abstract: The present disclosure discloses an apparatus for protection against electrostatic discharge and a method of manufacturing the same. The apparatus comprises: a first input/output pad electrically connected to an input/output pin and comprising an input/output protection circuit provided between a power source line and a ground line, wherein the input/output protection circuit is configured to release an electrostatic discharge current generated at the input/output pin; and a second input/output pad which is an empty pad electrically connected to the input/output pin and an RF input/output terminal of an internal RF circuit and is configured to receive a signal from the input/output pin and transmit the signal to the internal RF circuit. With the above apparatus, parasitic capacitive load can be minimized while electrostatic protection is performed on the RF circuit.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: October 4, 2022
    Assignee: Hangzhou Geo-Chip Technology Co., Ltd.
    Inventor: Chun Geik Tan
  • Publication number: 20220292242
    Abstract: Described is a method comprising a processing, an establishing, and/or a determining. In the processing, an inputted capabilities list including one or more hardware design capabilities may be processed. In the establishing, one or more candidate components for the one or more hardware design capabilities may be established. In the determining, a set of unique candidate netlists capable of satisfying the one or more hardware design capabilities may be determined, the set of unique candidate netlists being based upon the set of candidate components.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 15, 2022
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Danielle Morton, Rick Yan
  • Patent number: 11418196
    Abstract: Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: August 16, 2022
    Assignee: Shenzhen Chipuller Chip Technology Co., LTD
    Inventors: Meng Yan, Omar Mahmoud Adfal Alnagger, Myron O. Shak, Soheil Gharahi
  • Publication number: 20220253584
    Abstract: Described is an apparatus for supporting Over-The-Air Hardware Updates comprising a first circuitry, a second circuitry, and a third circuitry. The first circuitry may be operable to be fastened and electrically coupled in one or more regions to one or more respectively corresponding semiconductor dies. The second circuitry may be operable to configure the one or more regions of the first circuitry. The third circuitry may be operable to provide a set of wirelessly-received configuration instructions to the second circuitry.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 11, 2022
    Applicant: Shenzhen Chipuller Chip Technology Co., LTD.
    Inventors: Hao Hua, Jawad Nasrullah
  • Patent number: 11411570
    Abstract: The present disclosure provides a multi modulus frequency divider and an electronic device. The duty cycle adjusting circuit in the multi modulus frequency divider is configured to generate a second output clock signal according to a first output clock signal and an input modulus signal received by one or more frequency division units, the frequency of the second output clock signal is the same as that of the first output clock signal, and the duty cycle of the second output clock signal is different from that of the first output clock signal. The duty cycle of the clock signal output by the multi modulus frequency divider provided in the present disclosure is generally closer to 50%.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: August 9, 2022
    Assignee: HANGZHOU GEO-CHIP TECHNOLOGY CO., LTD.
    Inventor: Yanping Zhou
  • Patent number: 11405002
    Abstract: The present disclosure discloses a harmonic rejection mixing circuit device and a receiver. In the harmonic rejection mixing circuit device, outputs of first and fourth mixers are combined with the input terminal of the fourth mixer being connected to a capacitor, the first mixer samples a first group of local oscillator (LO) signals, and the fourth mixer phase-invertedly samples the first group of LO signals, thus the noise introduced by a fundamental LO signal input to the first mixer may be eliminated using the double balance feature of the fourth mixer core, thereby ensuring a high signal-to-noise ratio of the receiver. Similarly, the noises introduced by fundamental LO signals input to second and third mixers may be eliminated respectively using the double balance features of the fifth and sixth mixer cores, thereby lowering the noise figure to ensure a high signal-to-noise ratio of the receiver.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: August 2, 2022
    Assignee: Hangzhou Geo-Chip Technology Co., Ltd.
    Inventor: Chun Geik Tan
  • Patent number: 11405062
    Abstract: The present disclosure discloses a startup circuit device, a filter and a receiver. The startup circuit device is applicable to the filter that includes a fully-differential operational amplifier and a common-mode feedback circuit device connected in sequence. Both the first startup input terminal and the first startup output terminal are connected to a first amplification input terminal of the fully-differential operational amplifier, and both the second startup input terminal and the second startup output terminal are connected to a second amplification input terminal of the fully-differential operational amplifier.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: August 2, 2022
    Assignee: Hangzhou Geo-chip Technology Co., Ltd.
    Inventor: Li Xu