Abstract: In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.
Type:
Grant
Filed:
March 11, 2022
Date of Patent:
April 29, 2025
Assignee:
Chipletz, Inc.
Inventors:
Michael Su, Michael Alfano, Siddharth Ravichandran
Abstract: In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.
Type:
Application
Filed:
July 15, 2024
Publication date:
January 9, 2025
Applicant:
Chipletz, Inc.
Inventors:
Michael Su, Michael Alfano, Siddharth Ravichandran
Abstract: Structures and methods of forming a thin-film electrolytic capacitor without the conductive polymer, thus improving the ESR performance as well as the reliability of the capacitor. Thin-film electrolytic capacitor structures include sintered anode, oxide deposition, conductive polymer, conductive metal inks, and metal cathodes.
Type:
Application
Filed:
January 31, 2024
Publication date:
August 1, 2024
Applicant:
Chipletz, Inc.
Inventors:
Siddharth Ravichandran, Michael Alfano, Bryan Black, Michael Su
Abstract: A semiconductor package substrate with embedded crack cessation structures and methods of forming the same is provided. Crack cessation structures include blind vias structures, through vias structures, and methods of forming the same are provided. Crack cessation structures may be formed by trenching of one or more structures, and deposition of metallic or insulative materials to form a crack cessation structures in the semiconductor package substrate core.
Type:
Application
Filed:
October 10, 2023
Publication date:
April 11, 2024
Applicant:
Chipletz, Inc.
Inventors:
Michael Su, Siddharth Ravichandran, Michael Alfano, Bryan Black
Abstract: A semiconductor package substrate with embedded passive devices and methods of forming the same is provided. Embedded passive devices include inductors and inductor modules and methods of forming the same are provided. Embedded inductors may be formed by deposition of magnetic core material, trenching of one or more channels, and placement of conductive wires to form an module embeddable in the semiconductor package substrate core. Provided are methods and apparatus for formation of embeddable pot-core, toroidal, and helical inductors.
Type:
Application
Filed:
June 7, 2023
Publication date:
December 7, 2023
Applicant:
Chipletz, Inc.
Inventors:
Siddharth Ravichandran, Michael Su, Michael Alfano, Bryan Black
Abstract: In integrated circuit packages, a coaxial pair of signals are routed through a plated through hole between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods and apparatuses where signals are routed within a concentric reference conductor within traditional package substrates. Methods for forming a hole in the core substrate material through which the coaxial pair of signals is passed on a fine pitch.
Type:
Application
Filed:
April 22, 2023
Publication date:
October 26, 2023
Applicant:
Chipletz, Inc.
Inventors:
Bryan Black, Siddharth Ravichandran, Michael Su, Michael Alfano