Patents Assigned to CHIPMETRICS OY
  • Apparatus associated with analysis of thin film layer and manufacturing method thereof
    Patent number: 11668561
    Abstract: An apparatus associated with an analysis of a thin film layer comprises two layer structures (100, 102) with a cavity (104) therebetween, and an opening (110) through one of the layer structures (102) to the cavity (104), the cavity (104) being configured to receive, through the opening (110), material used to form a thin film layer (900) inside the cavity (104). At least one of the two layer structures (100, 102) comprises at least one positional indicator (108) for an analysis associated with the thin film layer (900).
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: June 6, 2023
    Assignee: CHIPMETRICS OY
    Inventors: Riikka Puurunen, Feng Gao