Abstract: A rigid flex circuit board and a method of fabricating a rigid flex circuit board. The method comprising forming a stack of at least two layers of at least one of a flexible material, prepreg material, insulative material, or conductive material over a flexible core to form a structure, wherein the structure comprises a first rigid portion, a second rigid portion, a flexible portion extending between the first and second rigid portions, and a removable rigid portion extending between the first rigid portion and the second rigid portion, processing the structure to form interconnects; and removing the removable rigid portion.