Abstract: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB.

Abstract: Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB.

Abstract: Embodiments of the present disclosure relate to the field of printed circuit boards and particularly to a multi-layer printed circuit board. The multi-layer printed circuit board includes at least two inner-layer circuit boards, each of which has a non-circuit pattern area including a welding area. Each welding area has at least one welding hole. Further, at least one prepreg is used to fill between two adjacent inner-layer circuit boards and is melted to fill into the welding hole in a welding process. In the multi-layer printed circuit board according to the embodiments of the disclosure, a welding area is arranged in a non-circuit pattern area, and one or more welding holes are arranged in the welding area so that a prepreg between two inner-layer circuit boards can be melted filling into the welding hole(s) in a welding process, thus enhancing effectively an adhesive force binding the inner-layer circuit boards.

Abstract: Disclosed are a purple solder proof ink composition for printing circuit board, a process for preparing a purple printed circuit board, and a purple printed circuit board.