Abstract: The invention resides in the addition of large quantities of sodium fluoride to a chemical plating solution for depositing nickel on a catalytic substrate. The purpose of the addition is to increase the rate of deposition of an electroless nickel plating bath. In this way, heavy deposits may be made on substrates without substantial surface roughness, the control and integrity of the properties of the bath can be better maintained, concentrations of additives needed to maintain control of bath properties can be reduced, and the life of the plating bath can be extended.