Patents Assigned to Chu, Tse Ming
  • Integrated circuit connecting structure having flexible layout
    Publication number: 20100244200
    Abstract: A wafer has a cutting part filled with a connecting medium. After the wafer is cut into chips along the cutting part, two contacts on two surfaces of the chip can be connected through corresponding leading wires and the connecting medium. Thus, the chip can have a flexible layout.
    Type: Application
    Filed: July 24, 2007
    Publication date: September 30, 2010
    Applicants: Chu, Tse Ming, Ma, Sung Chuan
    Inventors: Tse Ming Chu, Sung Chuan Ma