Patents Assigned to CHUO KIKAI CO., LTD
  • Patent number: 10640875
    Abstract: A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: May 5, 2020
    Assignees: JCU CORPORATION, CHUO KIKAI CO., LTD
    Inventors: Makoto Kohtoku, Yaichiro Nakamaru, Yukio Shinozaki, Tetsuya Aoki, Takashi Matsukura, Goki Hashimoto
  • Publication number: 20190024238
    Abstract: A wet type processing apparatus includes a processing bath for reserving inside the processing liquid and rendering the resin film pass through the processing liquid; a pair of conveyance members arranged on a loading side for the resin film of the processing bath and on a delivery side for resin film of the processing bath at a position higher than a liquid surface of the processing liquid reserved in the processing bath; and a spouting unit arranged between the pair of the conveyance members at a position lower than the conveyance members and formed with a circumferential surface having plural holes for spouting the processing liquid from the circumferential surface to change a direction of the resin film along the circumferential surface in a non-contact manner in the processing liquid according to spouted flows from the holes.
    Type: Application
    Filed: January 12, 2016
    Publication date: January 24, 2019
    Applicants: JCU CORPORATION, CHUO KIKAI CO., LTD
    Inventors: Makoto KOHTOKU, Yaichiro NAKAMARU, Yukio SHINOZAKI, Tetsuya AOKI, Takashi MATSUKURA, Goki HASHIMOTO