Abstract: A backlight module and a display device are disclosed. The backlight module includes a back plate, an assembled light plate composed of multiple light plates, and a pressure bar. The assembled light plate is fixed to the back plate by the pressure bar. The pressure bar includes a fixing portion and a connecting portion. One end of the connecting portion goes through the gap, and the other end is connected to the fixing portion. The fixing portion extends from the gap to the light plates on both sides to form a first abutting portion and a second abutting portion. The surfaces of the first and the second abutting portions adjacent to the light plates are level and flush with each other. The first and the second abutting portions respectively abut and firmly press the light-emitting surfaces of the light plates on both sides. The fixed portion covers the entire gap.

Abstract: An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes a display area and a non-display area in which a peripheral circuit is provided. The peripheral circuit includes a test area, a bonding area, and a cutting area. The test area is provided with a test signal line for providing a test signal. The bonding area is adjacent to the display area, and the bonding area and the test area are electrically connected through signal leads. The cutting area is disposed between the test area and the bonding area. After a cutting process is completed in the cutting area, a cutting opening is formed on each signal lead. A position of the cutting opening of at least one signal lead is different from positions of the cutting openings of other signal leads in height along an extending direction of the signal leads.

Abstract: A pixel driving circuit and a display panel are provided. The pixel driving circuit, including a first-color subpixel, a second-color subpixel, and a third-color subpixel, is configured to drive a pixel unit. The pixel driving circuit includes a first driving unit, a second driving unit, and a third driving unit. The first driving unit is configured to drive according to a first voltage signal the first-color subpixel. The second driving unit is configured to drive according to the first voltage signal the second-color subpixel. The third driving unit is configured to drive according to the first voltage signal the third-color subpixel. The first driving unit at least includes a first capacitor, the second driving unit at least includes a second capacitor, the third driving unit at least includes a third capacitor, and at least one of the first capacitor, the second capacitor, and the third capacitor has a different capacitance.

Abstract: A pixel driving circuit and a display panel are provided. The pixel driving circuit, including a first-color subpixel, a second-color subpixel, and a third-color subpixel, is configured to drive a pixel unit. The pixel driving circuit includes a first driving unit, a second driving unit, and a third driving unit. The first driving unit is configured to drive according to a first voltage signal the first-color subpixel. The second driving unit is configured to drive according to the first voltage signal the second-color subpixel. The third driving unit is configured to drive according to the first voltage signal the third-color subpixel. The first driving unit at least includes a first capacitor, the second driving unit at least includes a second capacitor, the third driving unit at least includes a third capacitor, and at least one of the first capacitor, the second capacitor, and the third capacitor has a different capacitance.

Abstract: The present application discloses a array substrate, a manufacturing method of the array substrate, and a display panel, the manufacture procedure includes the following steps: sequentially forming a buffer layer and a photoresist layer on a glass substrate; placing the substrate into an activation agent for activation, and forming an activation liquid particle layer with a first preset pattern at a corresponding position where the activation agent is in contact with the photoresist layer, and forming an activation liquid particle layer with a second preset pattern at a corresponding position where the activation agent is in contact with the buffer layer; removing the photoresist layer and the activation liquid particle layer with the first preset pattern; and performing chemical plating to form a first metal layer at a position corresponding to the activation liquid particle layer with the second preset pattern in contact with the buffer layer.

Abstract: A display panel and a display device are provided. The display panel includes multiple sub-panels. The sub-panel includes a first substrate, a first signal-transmission layer disposed on the first substrate, and a light-emitting layer disposed at the first substrate and electrically coupled with the first signal-transmission layer. The display panel further includes a second substrate, a second signal-transmission layer disposed on the second substrate, and multiple conductive transfer members. The second substrate is disposed in correspondence with the multiple sub-panels and disposed opposite to and spaced apart from the first substrate. The multiple of conductive transfer members are disposed at the first substrate, where each conductive transfer member is electrically coupled with the first signal-transmission layer and the second signal-transmission layer.

Abstract: An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes a display area and a non-display area in which a peripheral circuit is provided. The peripheral circuit includes a test area, a bonding area, and a cutting area. The test area is provided with a test signal line for providing a test signal. The bonding area is adjacent to the display area, and the bonding area and the test area are electrically connected through signal leads. The cutting area is disposed between the test area and the bonding area. After a cutting process is completed in the cutting area, a cutting opening is formed on each signal lead. A position of the cutting opening of at least one signal lead is different from positions of the cutting openings of other signal leads in height along an extending direction of the signal leads.

Abstract: Disclosed are a method and a device for repairing a circuit on an array substrate, and an array substrate. The method includes: determining a section to be repaired on each signal line; applying a conductive material to form a repair line between two ends of the section to be repaired, the repair line being connected with two ends of the section to be repaired; and applying an insulating material to form a cover layer above the repair line, the cover layer completely covers the surface of the repair line.

Abstract: The present application discloses a cutting method for a display panel, a display panel and a display device, the cutting method for a display panel including a cutting stage of a side edge of a binding area and a cutting stage of a side edge of a non-binding area, the cutting stage of a side edge of a non-binding area includes steps of: aligning a cutter according to an alignment mark preset on the side edge of the non-binding area on the display panel, so that a cutter on a second substrate side is closer to a display area of the display panel than a cutter on a first substrate side, and cutting the first substrate and the second substrate by the cutter on the second substrate side and the cutter on the first substrate side respectively.

Abstract: A display panel and a display device including the display panel are disclosed. The display panel includes an array substrate, a color film substrate, and a liquid crystal layer and a first spacer both between the array substrate and the color film substrate. Assembly surfaces of the color film substrate and the array substrate are oppositely assembled. An edge of the assembly surface of the color film substrate is provided with an edge shielding area. An edge of the assembly surface of the array substrate is provided with a component located in a projection of the edge shielding area on the array substrate. The first spacer is located in the edge shielding area and outside the projection of the component on the edge shielding area. The first spacer supports the edge shielding area and an area of the array substrate corresponding to the edge shielding area.

Abstract: Disclosed are a method and a device for monitoring downtime of a target machine, and a computer readable storage medium. The method includes the following operations: receiving operating state information of the target machine in real time; determining whether the target machine is down according to the operating state information; and sending downtime prompt information to a mobile terminal account of a person responsible for the target machine when the target machine is down.

Abstract: The present application discloses a gate driver circuit of a display panel, a driving method therefor and a display circuit. The gate driver circuit of a display panel includes a multi-stage cascaded shift register, where an any-stage shift register includes: a charging circuit, a pull-down circuit for controlling to pull down a potential of an output terminal of the charging circuit to a low level in a non-scanning time, and an output control circuit electrically coupled to the output terminal of the charging circuit for receiving an initial gate scanning signal; the output control circuit is connected to an enable signal and controls the output of the gate scanning signal according to the enable signal.

Abstract: An array substrate, a manufacturing method thereof, and a display device are provided. The array substrate includes a display area and a non-display area in which a peripheral circuit is provided. The peripheral circuit includes a test area, a bonding area, and a cutting area. The test area is provided with a test signal line for providing a test signal. The bonding area is adjacent to the display area, and the bonding area and the test area are electrically connected through signal leads. The cutting area is disposed between the test area and the bonding area. After a cutting process is completed in the cutting area, a cutting opening is formed on each signal lead. A position of the cutting opening of at least one signal lead is different from positions of the cutting openings of other signal leads in height along an extending direction of the signal leads.