Patents Assigned to CICT
  • Patent number: 10377169
    Abstract: Disclosed herein are an exterior forming method and an exterior forming structure of an electronic component. The exterior forming method of an electronic component may include mounting an injection-molded product, which is injection molded as an electronic component, to an upper portion a heat transferring base unit, mounting a printing film having an ink layer for a heat transfer to the upper portion of the heat transferring base unit such that the ink layer faces an upper surface of the injection-molded product, and heat-transferring the ink layer on the upper surface of the injection-molded product by rotating a heating roll while closely attached at an upper portion of the printing film. The exterior forming method may also include forming an UV coating layer on an upper portion of the ink layer that is heat-transferred on the injection-molded product.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: August 13, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., CICT
    Inventors: Sung Woon Yoon, Sung-Hai Lee, Kyo Ree Lee, Hui-Cheol Kim, Dae-Keun Youn
  • Publication number: 20160311142
    Abstract: Disclosed herein are an exterior forming method and an exterior forming structure of an electronic component. The exterior forming method of an electronic component may include mounting an injection-molded product, which is injection molded as an electronic component, to an upper portion a heat transferring base unit, mounting a printing film having an ink layer for a heat transfer to the upper portion of the heat transferring base unit such that the ink layer faces an upper surface of the injection-molded product, and heat-transferring the ink layer on the upper surface of the injection-molded product by rotating a heating roll while closely attached at an upper portion of the printing film. The exterior forming method may also include forming an UV coating layer on an upper portion of the ink layer that is heat-transferred on the injection-molded product.
    Type: Application
    Filed: April 25, 2016
    Publication date: October 27, 2016
    Applicants: SAMSUNG ELECTRONICS CO., LTD., CICT
    Inventors: Sung Woon YOON, Sung-Hai LEE, Kyo Ree LEE, Hui-Cheol KIM, Dae-Keun YOUN
  • Patent number: 9452649
    Abstract: A tilting trailer is proposed that includes a chassis mounted on an axle that pivots with respect to wheels of the trailer. The trailer includes an articulated drawbar mounted on the axle, the articulated drawbar being mounted so that it is free and sliding with respect to the chassis; and an actuator sliding the articulated drawbar. The articulated drawbar is V-shaped, a first end is fixed to a hitch tongue, a second end is fixed to the axle near a first wheel, and a third end is fixed to the axle near a second wheel.
    Type: Grant
    Filed: June 11, 2013
    Date of Patent: September 27, 2016
    Assignee: CICT
    Inventor: Christian Tortellier