Abstract: A vacuum operated apparatus is provided for releasably grasping and transporting a thin solid object or article (e.g. silicon semiconductor wafer). The apparatus has two fixed rigid arms joined together at their rear end to define a gap therebetween having an open end and closed end wherein the upper arm directs the thin solid object into the gap and toward the lower arm having a port communicating with the gap and an enclosed passage way connected to a vacuum source. A vacuum applied to the lower arm holds the object against the grasping surface of the lower arm. Silicon semiconductor wafers may be grasped and transported with the apparatus and more especially silicon semiconductor wafers can be deposited onto and removed from the surface of a barrel type susceptor of an epitaxial reactor with enhanced ease and reduced danger of scratching and breaking the wafer.

Abstract: A blow molding machine is provided with an external center pin so that blowing is accomplished without introducing a mechanical or rigid member within the preform and/or bottle. To do this, the blowing is done by introducing a fluid, preferably a gas such as air, into the preform to expand it. Outside of the preform, meanwhile, is the subject center pin or center rod which is located on the preform center line (axis) and near the middle of the preform bottom. The rod receives a gate disposed centrally on the bottom of the preform when the preform is expanded by the entering fluid. In this manner, the center part of the bottom of the preform is engaged by the center pin which thereafter keeps the preform on center as the blowing action continues. A process is disclosed of blowing using a compressed fluid alone inside the preform to expand the preform axially against the bias of an external resiliently biased center pin.

Abstract: A plurality of like modules having an open sided C-frame construction are provided with slot-forming guides for receiving a plurality of circuit boards which are inserted from the open side. The circuit boards, when fully received in the guide slot, are engageable with electrical connectorings on the main body section of the C-frame. A plenum chamber is formed on the bottommost surface of the plurality of C-frame modules, and vent slots are provided through the modules at the upper and lower limbs of the C-frame, thereby permitting air to be ducted through the plenum chamber and convected up through the vent slots, thereby dissipating heat from the circuit boards. Means is provided for connecting the plurality of modules in a predetermined fashion to one another, to form a rigid assembly.

Abstract: Apparatus for controlled dielectric heating a plurality of thermoplastic preforms for blow molding is provided. The apparatus controls the energization of a plurality of electrode pairs by a radio frequency generator. The generator is equipped with a load current limit detector and the electrode energization is enabled selectively for a predetermined time or until a predetermined load current magnitude is reached. The choice of control is determined by the anticipated load as reflected by the number of preforms within the heating station. The generator is further provided with overload detecting means indicative of the occurrence of electrical arcing within the heating station and the apparatus has further means responsive to the arc detector for selectively momentarily or indefinitely deenergizing the electrodes.

Abstract: An improvement in the ejection means or ejection station of the machine described in U.S. Pat. No. 4,133,625. The improved structure employs a finger with a resilient (e.g. rubber) face or a similar striking instrument to strike the inside of the cup, tub or other hollow object being made and knock it loose and into a predetermined trajectory so that the product can be recovered with no damage to its finish. In accomplishing this, the finger is mounted on a vertically moving yoke that engages the carrier plate-tip ring assembly to which the product is temporarily adhered. With this construction, the finger strikes the product and knocks it loose during motion of the frame.

Abstract: An apparatus is disclosed for modifying the motion of a tool centerpoint associated with the function element of a robot arm. The motion to be modified is produced during an automatic mode of operation in which the tool centerpoint travels along predetermined paths between programmed points at a programmed velocity. The apparatus is effective to modify the motion during the automatic mode in response to sensed deviations from the predetermined path. Two alternative schemes of modifying the motion are disclosed. A first alternative scheme returns the tool centerpoint to the predetermined path before it reaches the programmed point defining the end of the path. A second alternative scheme produces a new end point offset from the programmed end point and effects motion along offset paths which are translated and rotated from the predetermined paths defined by the programmed points.