Patents Assigned to Circuit Chemistry Corporation
  • Patent number: 4739780
    Abstract: Vertical photoresist developer for processing of any size of printed circuit boards carried on a processing cassette. The processing cassette is carried by a chain through a main chamber, a rinse chamber and a drying chamber, all the processing chambers in line with each other. The processing system is electromechanical and electrically controlled, as well as air and liquid flow control. The developer is system oriented and symmetrical in operation to either side of the board. A printed circuit board holder with gripper fingers mounted in removable plastic chain cassette carries the board through separable processing chambers.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: April 26, 1988
    Assignee: Circuit Chemistry Corporation
    Inventors: James J. Czaja, John J. Herrmann
  • Patent number: 4732173
    Abstract: Vertical photoresist developer for processing of any size of printed circuit boards carried on a processing cassette. The processing cassette is carried by a chain through a main chamber, a rinse chamber and a drying chamber, all the processing chambers in line with each other. The processing system is electromechanical and electrically controlled, as well as air and liquid flow control. The developer is system oriented and symmetrical in operation to either side of the board.
    Type: Grant
    Filed: December 20, 1985
    Date of Patent: March 22, 1988
    Assignee: Circuit Chemistry Corporation
    Inventors: James J. Czaja, John J. Herrmann
  • Patent number: 4397753
    Abstract: Solder stripping solution having an extended life for stripping and removing tin-lead alloy solder or tin deposits from entire circuits or tabs with an insignificant amount of attack on the base epoxy laminate or underlay copper or nickel substrate while leaving a residue-free substrate surface. This solution can be utilized at room temperature or preferably slightly above, and has a prolonged useful life of weeks to months. The composition of the solution includes a hydroxyphenol in an aqueous solution of a nitro-substituted aromatic compound, an inorganic acid, and thiourea.
    Type: Grant
    Filed: September 20, 1982
    Date of Patent: August 9, 1983
    Assignee: Circuit Chemistry Corporation
    Inventor: James J. Czaja
  • Patent number: RE32555
    Abstract: Solder stripping solution having an extended life for stripping and removing tin-lead alloy solder or tin deposits from entire circuits or tabs with an insignificant amount of attack on the base epoxy laminate or underlay copper or nickel substrate while leaving a residue-free substrate surface. This solution can be utilized at room temperature or preferably slightly above, and has a prolonged useful life of weeks to months. The composition of the solution includes a hydroxyphenol in an aqueous solution of a nitro-substituted aromatic compound, an inorganic acid, and thiourea.
    Type: Grant
    Filed: August 2, 1985
    Date of Patent: December 8, 1987
    Assignee: Circuit Chemistry Corporation
    Inventor: James J. Czaja