Abstract: An electrolytic copper foil is disclosed. The electrolytic copper foil has an excellent elongation by adjusting an average cross-sectional grain size on at least one surface area of the electrolytic copper foil, with respect to a cross-section perpendicular to a longitudinal direction, and a ratio of the grain size. An electrode for a secondary battery and a secondary battery including the electrolytic copper foil are disclosed.

Abstract: The present invention provides an electrodeposited copper foil suitable for a lithium-ion secondary battery, in which a tensile strength in an ordinary state is 50 kgf/mm2 or more and a tensile strength after continuous heat treatment at 190° C. for 24 hours is 35 to 30 kgf/mm2.

Abstract: An electrolytic copper foil having improved elongation and electrical conductivity is disclosed. The improved elongation and electrical conductivity are due to an increase in shape deformation of grains selective to a specific direction and an increase in an average grain size after heat treatment. An electrode for a secondary battery including the electrolytic copper foil, and a secondary battery including the electrode are disclosed.

Abstract: An electrolytic copper foil securing high strength characteristics such as tensile strength is disclosed. The electrolytic copper foil can secure high strength characteristics by maintaining an area ratio of fine grains and grain boundaries in the electrolytic copper foil even after high-temperature heat treatment. An electrode for a secondary battery including the electrolytic copper foil, and a secondary battery including the electrode are also disclosed.

Abstract: A double layered electrolytic copper foil is disclosed. It is possible to freely control various physical properties of the double layered electrolytic copper foil. The double layered electrolytic copper foil contains a first copper layer, a second copper layer, and an interface formed between one surface of the first copper layer and one surface of the second copper layer. A method of manufacturing the double layered electrolytic copper foil is also disclosed.

Abstract: A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.

Abstract: A copper foil having high fracture energy after heat treatment to be strong against breakage is disclosed. Also disclosed are an electrode for secondary batteries and a secondary battery exhibiting, by including the copper foil, excellent characteristics in terms of, for example, cycle lifespan, safety, and workability.

Abstract: A copper foil having high fracture energy to be strong against breakage is disclosed. An electrode for secondary batteries and a secondary battery exhibiting, by including the copper foil, excellent characteristics in terms of, for example, cycle lifespan, safety, and workability are also disclosed.

Abstract: A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.

Abstract: Disclosed herein relates to a copper foil having a low roughness property by roughening a matte side, wherein a thickness of the copper foil is from 5 ?m to 70 ?m, and profilometer-measured mean roughness of the roughened surface of the copper foil is from 0.5 ?m to 2.0 ?m, and wherein profilometer-measured mean roughness Rz JIS of the roughened matte side of the copper foil is lower than that of a shiny side of the copper foil. The copper foil provided in the present invention has excellent adhesion with a resin and an electrical property while having low roughness through surface roughening.

Abstract: A copper-clad laminate including at least one of a copper layer having a roughened surface is disclosed. The copper-clad laminate is obtained by roughening at least one surface of a base copper layer so as to have a low profile comprising a copper layer having a thickness of from 5 ?m to 70 ?m and a resin layer on the copper layer, wherein a peeling strength between the copper layer and the resin layer is more than 0.6 N/mm when the thickness of the copper layer is more than 5 ?m, wherein a ten-point mean roughness Sz of the roughened surface is lower than that of the base copper layer.

Abstract: A surface-treated copper foil, which is excellent in adhesiveness with an insulating substrate for a high-frequency circuit, and particularly is capable of producing a copper clad laminate where occurrence of blisters are suppressed even when a thermal load due to high temperature press-working is applied. More particularly, it is a surface-treated copper foil for a high-frequency circuit having a heat resisting treated layer formed on a copper foil of 35 ?m or less in thickness, in which the heat resisting treated layer is characterized by a film including a quaternary metal oxide of chromium, molybdenum, zinc, and nickel and a compound thereof, characterizes the present invention.

Abstract: A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 ?m. There is also presented a method for manufacturing such a composite copper foil.

Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.

Abstract: A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting resin layer, the functional copper foil being electro-deposited with a uniform thickness of more than 4 &mgr;m but less than 10 &mgr;m on the carrier foil, the functional copper foil having a front side facing the carrier foil and an opposite backside which is coated with the non-reinforced thermosetting resin layer. The method further involves laminating the composite foil with the non-reinforced thermosetting resin layer on the core board and removing the carrier foil from the functional copper foil in order to uncover the front side of the functional copper foil. A CO2 laser source drills holes from the uncovered front side of the functional copper foil through the functional copper foil and the non-reinforced thermosetting resin layer to form microvias.