Abstract: Disclosed herein relates to a copper foil having a low roughness property by roughening a matte side, wherein a thickness of the copper foil is from 5 ?m to 70 ?m, and profilometer-measured mean roughness of the roughened surface of the copper foil is from 0.5 ?m to 2.0 ?m, and wherein profilometer-measured mean roughness Rz JIS of the roughened matte side of the copper foil is lower than that of a shiny side of the copper foil. The copper foil provided in the present invention has excellent adhesion with a resin and an electrical property while having low roughness through surface roughening.

Abstract: A copper-clad laminate including at least one of a copper layer having a roughened surface is disclosed. The copper-clad laminate is obtained by roughening at least one surface of a base copper layer so as to have a low profile comprising a copper layer having a thickness of from 5 ?m to 70 ?m and a resin layer on the copper layer, wherein a peeling strength between the copper layer and the resin layer is more than 0.6 N/mm when the thickness of the copper layer is more than 5 ?m, wherein a ten-point mean roughness Sz of the roughened surface is lower than that of the base copper layer.

Abstract: A peelable composite foil includes a metallic carrier foil, a first barrier layer on one side of the metallic carrier and a second metallic layer on the first barrier layer. The second metallic layer includes a combination of a metal selected from the group including zinc, molybdenum, antimony and tungsten, and an electrodeposited, ultra-thin metal foil on the second metallic layer.