Patents Assigned to Circuit Research Corp.
  • Printed circuit manufacturing process using tin-nickel plating
    Patent number: 6015482
    Abstract: A process for manufacturing a printed circuit that replaces tin and/or tin-lead electroplating with tin-nickel based electroplating. The process includes printing a desired circuitry pattern onto a resist-coated copper-clad substrate. A tin-nickel material is electroplated onto the desired circuitry pattern, and the resist removed. The tin-nickel electroplating takes place within a bath comprised of a nickel source, a stannous source and a starter solution including a bifluoride salt, diethylenetriamine and triethylenetetramine.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: January 18, 2000
    Assignee: Circuit Research Corp.
    Inventor: Theodore R. Stern