Abstract: A plurality of workpiece layers of material are disclosed. The plurality of workpiece layers of material include a dual-sided adhesive layer assembly having a first side surface and a second side surface opposite the first side surface. The plurality of workpiece layers of material also include a first substrate layer non-removably-connected to the dual-sided adhesive layer assembly.
Abstract: A cutting machine includes a working surface, a carriage, a tool, and a drive mechanism. The carriage is disposed above the working surface. The tool is removably secured to the carriage and configured to move (i) toward the working surface along a first axis, (ii) relative to the working surface along a second axis transverse to the first axis, and (iii) relative to the working surface along a third axis transverse to the first axis and the second axis. The drive mechanism is offset from the first axis and configured to move the tool along the first axis.
Type:
Application
Filed:
December 11, 2020
Publication date:
January 5, 2023
Applicant:
Circut, Inc.
Inventors:
Jeremy Burton Crystal, Sterling Kingdon, Kay Beauwen Frekleton, Adam Worsham
Abstract: The present invention relates to a method and an apparatus for a resurfaceable contact pad that uses an epoxy to encapsulate contact pads so that the epoxy and encapsulated contact pads are coplanar on a silicon redistribution interposer. These redistribution interposers electrically connect a wafer semi-conductor to a probe card where it is necessary to convert the course pad arrangement of one with a fine pad arrangement of the other through the use of an interposer board. The present invention relates to an apparatus and a method creates resurfaceable contact pads which may be resurfaced one or multiple times with an abrasive sanding operation to recreate a coplanar surface should any contact pad surfaces become damaged, allowing for a more cost-effective repair.