Abstract: An apparatus for automatically testing printed circuit boards on which the test points are locatable at row and column intersections of a grid is described. The apparatus has two bars mounted above the printed circuit board in parallel alignment with the columns of the possible test points. Each bar has a set of probe contacts depending therefrom which can be placed into contact with the test points on the printed circuit board located along a single column. The bars are movable relative to the printed circuit board and may be sequentially placed into contact with any selected pair of columns of possible test points. Test voltages are sequentially applied to selected pairs of the probe contacts, enabling the electrical characteristics between the pairs of test points on the printed circuit board to be measured. A micro-processor is used to control the testing sequence and in correlating the results.