Abstract: A method of depositing a copper thin film inside a TGV using atomic layer sputtering epitaxy (ASE) is characterized in that the copper thin film is homogeneously deposited on the inside and surface of the TGV using an ASE process, and the copper thin film is deposited so that the upper and lower electrical resistances of the TGV are less than or equal to 0.1 ?.

Abstract: The present invention relates to a method of manufacturing a flexible copper clad laminated film having a polytetrafluoroethylene (PTFE) substrate. More specifically, the present invention relates to a method of manufacturing a flexible copper clad laminated (FCCL) film having a polytetrafluoroethylene (PTFE) substrate, in which a metal thin film is uniformly deposited on the polytetrafluoroethylene (PTFE) substrate to manufacture a flexible copper clad laminated (FCCL) film, which can improve the electrical performance of the flexible copper clad laminated film and avoid the property degradation of the polytetrafluoroethylene (PTFE) substrate.

Abstract: A cosmetic impregnated foam manufacturing apparatus of the present disclosure includes: a fixing holder for fixing a container; a two or more multi nozzles for filling the container with liquid-state make-ups having different colors and viscosities; a pressing member pressing the impregnated foam to the container filled with the liquid-state make-ups; and a fabric placed on the impregnated foam. Accordingly, various colors and patterns are achieved by impregnating two or more liquid-state make-ups having different colors by the two or more multi nozzles and the fixing holder that is rotated and horizontally moved.