Patents Assigned to Citicorp North America, Inc.
  • Method of Making Multi-Chip Package with High-Speed Serial Communications between Semiconductor Dice
    Publication number: 20080113471
    Abstract: A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
    Type: Application
    Filed: January 10, 2008
    Publication date: May 15, 2008
    Applicant: Citicorp North America, Inc.
    Inventors: Michael Kelly, Paul Chenard, Revathi Polisetti, Patrick McKinley