Abstract: A semiconductor device wherein the horizontal spreading of solder at the time of reflow is suppressed and a plurality of devices can be mounted close to each other on a substrate, and a light-emitting apparatus using such a semiconductor device as a light-emitting device are provided. A semiconductor device bonded to a substrate by solder includes a semiconductor layer, a plurality of device electrodes formed on a bottom surface of the semiconductor layer, and a plurality of auxiliary electrodes formed integrally with the device electrodes, respectively, wherein each of the auxiliary electrodes includes a groove portion formed in a bottom surface thereof, and a side face of the groove portion is slanted with respect to the bottom surface of the semiconductor layer so that the groove portion becomes narrower in width with increasing distance from a lower end of the auxiliary electrode and decreasing distance to an upper end thereof.

Abstract: To provide an LED lighting apparatus and a method for manufacturing the same that can improve the bonding strength between an aluminum substrate and a printed wiring substrate. An LED lighting apparatus and a method for manufacturing the same, the LED lighting apparatus includes an aluminum substrate, a plurality of reflectivity-enhanced layers formed on the aluminum substrate, an LED device bonded on said plurality of reflectivity-enhanced layers, a printed wiring substrate bonded onto a region on the aluminum substrate other than a region where the plurality of reflectivity-enhanced layers are formed, a wire for connecting between the printed wiring substrate and the LED device, a frame member formed so as to surround said LED device, and a phosphor resin deposited over a region inside the frame member.

Abstract: An LED illuminator configured to further reduce total harmonic distortion is provided.

Abstract: In some embodiments, a light source including a first electrode that includes a projection and a depression, a second electrode including a projection and a depression, an insulating layer disposed between the first electrode and the second electrode, and a light-emitting element straddling the insulating layer and disposed on the projection of the first electrode and on the projection of the second electrode. In other embodiments, a lighting device including a base that includes a first terminal and a second terminal that are configured to be electrically connected to the light source to supply current to the light-emitting element. In some embodiments, the lighting device is a lighting bulb, and in other embodiments, the lighting device is tube-shaped.

Abstract: An LED lamp has a substrate on which an LED is mounted, a dome-shaped translucent part covering the LED, a heat-radiating section connected to the substrate, a metal cap section to be connected to a power supply source, and a socket unit for connecting the heat-radiation section and the metal cap section, the socket unit having a socket opening section; the heat-radiating section having a body section connected to the substrate, a plurality of heat-radiating fins connected to the body section, and a cover section connected to the heat-radiating fins, the cover section covering the heat-radiating fins; and an air channel being configured so as to pass through from a gap between the translucent part and the cover section, between the heat-radiating fins, and to the socket opening section.

Abstract: An LED light-emitting element having reduced the occurrence of illuminance unevenness is provided. A light-emitting element comprising a substrate, an LED element mounted on the substrate, a phosphor resin arranged on the substrate so as to seal the LED element and having an emission surface from which light based on light emitted from the LED element is emitted, a reflective resin arranged around the phosphor resin; and a reflecting frame having an opening and at least part of which is arranged on the reflective resin, wherein the reflective resin is arranged directly under the reflecting frame and on the side surface of the phosphor resin, the ratio of the area of the emission surface to the area of an inside area of the reflecting frame is set to 80% or higher, and in the inside area of the reflecting frame, the reflective resin is exposed around the emission surface.

Abstract: A light-emitting apparatus according to the present invention has a packaging substrate having a packaging area, a plurality of light-emitting elements packaged in the packaging area, and a sealing resin that seals the plurality of light-emitting elements. The plurality of light-emitting elements includes light-emitting elements packaged in a first packaging area including the center of the packaging area and light-emitting elements packaged in a second packaging area surrounding the perimeter of the first packaging area. The packaging density of the light-emitting elements packaged in the first packaging area is higher than the packaging density of the light-emitting elements packaged in the second packaging area.

Abstract: Provided is a compact and high-luminance semiconductor light-emitting device which has excellent color rendering characteristics and which enables arbitrary selection of emission color depending on the use of the device. The semiconductor light-emitting device includes a light-emitting element assembly configured by a plurality of fluorescent semiconductor light-emitting elements each of which has external connection electrodes respectively connected to an n-type semiconductor layer and a p-type semiconductor layer, wherein at least an outer surface other than the external connection electrodes of each of the fluorescent semiconductor light-emitting elements is coated with a resin containing a fluorescent material. The light-emitting element assembly is configured such that the external connection electrodes of the fluorescent semiconductor light-emitting elements are directly connected in series using solder.

Abstract: An LED apparatus includes a base having thermal conductivity, an insulative substrate provided on one surface of the base and including electrodes provided on a surface of the substrate, at least one base-mounting area that is an exposed part of the base, exposed within a pass-through hole provided in the substrate, a plurality of LED elements mounted on the base in the base-mounting area and some of the LED elements in a unit electrically connected to the electrodes in series, a plurality of the units are electrically connected in parallel, and a frame disposed to surround the base-mounting area and configured to form a light-emitting area.