Abstract: A light-emitting device includes a substrate that includes at least a pair of electrodes, an LED element electrically mounted on the substrate, a phosphor plate adhered to an upper surface of the LED element and including an upper surface and a lower surface each having an area larger than that of the upper surface of the LED element, a white resin provided on an upper surface of the substrate and seamlessly covering a peripheral side surface of the LED element and a peripheral side surface of the phosphor plate. A lower surface of the phosphor plate is adhered to the upper surface of the LED element through a transparent adhesive.

Abstract: In accordance with a first aspect of the present inventive subject matter, a lighting device includes light-emitting elements arranged in lines that are extended in parallel with one another, the light-emitting elements being divided into groups each including the same number of light-emitting elements, a first connecting electrode is disposed adjacent to one end portion of the lines extended, a second connecting electrode is disposed adjacent to another end portion of the lines extended, and the light-emitting elements within each group are electrically connected in series with one another by metallic wires and electrically connected in series to the first connecting electrode and to the second connecting electrode. The groups each include the same number of light-emitting elements that are electrically connected in parallel between the first connecting electrode and the second connecting electrode.

Abstract: In a first aspect of the present invention, a lighting device including a metal plate, an electrical insulation layer that is smaller in size than an outline of the metal plate and arranged on an upper surface of the metal plate, a light-emitting element mounted on the electrical insulation layer, and a first connecting electrode and a second connecting electrode electrically connected to the light-emitting element and arranged on the electrical insulation layer.

Abstract: Provided is a pushbutton switch that can be made thin without requiring that a notch be made into a mounting board. The pushbutton switch is provided with a first substrate having a housing recess part located on a surface of the first substrate, a center contact provided at roughly the center of the interior of the housing recess part, a pair of peripheral contacts provided on peripheral edge parts of the housing recess part, a movable contact spring that is installed on the pair of peripheral contacts and that touches the center contact upon being pressed, and a second substrate, which is provided with a pair of connection pads electrically connected to the first substrate. A cross section of the first and second substrates is formed as a whole into an “L”-like shape.

Abstract: A semiconductor device has a light emitting element, and a resin layer; the light emitting element includes a semiconductor laminated body in which a first semiconductor layer and a second semiconductor layer are laminated in sequence, a second electrode connected to the second semiconductor layer on an upper surface of the second semiconductor layer that forms an upper surface of the semiconductor laminated body, and a first electrode connected to the first semiconductor layer on an upper surface of the first semiconductor layer in which a portion of the second semiconductor layer on one surface of the semiconductor laminated body is removed and a portion of the first semiconductor layer is exposed; and the resin layer is configured to cover at least a side surface of the light emitting element, and an upper surface of the resin layer is lower than the upper surface of the semiconductor laminated body.

Abstract: The invention is directed to the provision of a method for manufacturing a semiconductor light-emitting element that eliminates the need for preparing a plurality of different fluorescent sheets. The method for manufacturing the semiconductor light-emitting element containing an LED die includes the steps of arranging the LED die on a fluorescent sheet containing a fluorescent substance and adjusting the amount by which the LED die is depressed into the fluorescent sheet so that the semiconductor light-emitting element has a desired color emission.

Abstract: An object of the present invention is to provide a light-emitting device having a temperature compensation function implemented with simple circuitry, and a method of temperature compensation in such a light-emitting device. More specifically, the invention provides a light-emitting device and a method of temperature compensation using a light-emitting device, wherein the light-emitting device includes a substrate, a first LED chip which is arranged on the substrate, and which has a characteristic such that ?x and ?y, each representing an amount of displacement on an xy chromaticity diagram, both are negative as temperature rises, and a second LED chip which is arranged on the substrate, and which has a characteristic such that ?x and ?y, each representing an amount of displacement on an xy chromaticity diagram, both are positive as temperature rises.

Abstract: A lighting device 1 includes a heat sink 2, a substrate 3 attached to a mounting portion 11 of the heat sink 2, a plurality of light sources 4 mounted on the substrate 3, and a cap 6 electrically connected to the substrate 3 while fixed to a rear portion of the heat sink 2 through a casing 5. The heat sink 2 has a three-dimensional shape including a plurality of mounting portions 11a, 11b and 11c facing in directions different from each other and provided at least at a front-end surface 12 of the heat sink 2. At least the front-end surface 12 is exposed to outside, and a plurality of heat-releasing fins 2a is provided around the front-end surface 12. The lighting device has a higher heat-releasing property, and can enlarge an illuminated area.

Abstract: When an LED lighting apparatus which is a lighter load than an incandescent lamp or halogen lamp is connected to a dimmer, a malfunction may occur. The invention prevents the occurrence of such malfunction without defeating the purpose of low power consumption of the LED lighting apparatus. More specifically, the LED lighting apparatus includes a rectifier circuit, a light-emitting circuit connected to the rectifier circuit and containing a single or a plurality of LEDs in which current begins to flow when an output voltage of the rectifier circuit exceeds a threshold voltage, and a bypass circuit having a bypass path for making the current flow to the rectifier circuit without passing through the light-emitting circuit, and a detecting unit for detecting the current flowing through the light-emitting circuit, and wherein when the current detected by the detecting unit exceeds a predetermined value, the bypass circuit shuts off the current flowing through the bypass path.

Abstract: A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.

Abstract: In a first aspect of the present invention, a light-emitting diode includes a light-emitting element with a p-n junction, a first light-transmitting member including a phosphor and sealing the light-emitting element, and first and second covers disposed on opposite surfaces of the first light-transmitting member. It is disclosed that the first and second covers extend over edges of the opposite surfaces of the first light-transmitting member. In a second aspect of the present invention, a first cover disposed on a first parallel surface of a first light-transmitting member can be greater in thickness than a second cover. In some embodiments, it is disclosed that a second light-transmitting member with higher diffusion coefficient than the first light-transmitting member disposed in contact with a first perpendicular surface of the first light-transmitting member.

Abstract: [Object] To provide a lubrication kit which is capable of improving wear resistance and durability of a sliding portion mounted in a small electronic device and which is capable of reducing a sound generated during driving. [Solution] A lubrication kit used for a small electronic device having a sliding portion, according to the present invention comprises at least one lubricant selected from a lubricant (1) comprising an anti-wear agent and a base oil which contains a polyol ester oil and/or a paraffinic hydrocarbon oil and a lubricant (2) comprising an anti-wear agent, polytetrafluoroethylene particles, and a base oil which contains a polyol ester oil and/or a paraffinic hydrocarbon oil, and a surface-treating agent obtained from a fluorine type surfactant and a phosphoric ester having a hydrocarbon group in which a part or all of hydrogen atoms have been substituted with a fluorine atom.

Abstract: In a first aspect of the present inventive subject matter, a light source includes a substrate that includes a first electrode and a second electrode, and light-emitting elements arranged in an area and divided into groups each including a same number N of light-emitting elements that are electrically connected to one another in series in each group of the groups and that are electrically connected in series to the first electrode and to the second electrode of the substrate, and the light-emitting elements include a first light-emitting element that is configured to start emitting light when a voltage applied to the light-emitting elements exceeds a first voltage value, and the light-emitting elements except the first light-emitting element are configured to start emitting light when the voltage exceeds a second voltage value that is higher than the first voltage value. Also, a lighting device including the light source is disclosed.

Abstract: In a first aspect of the present invention, a lighting device includes a substrate that includes a pair of electrodes as a first electrode and a second electrode, groups each including a same number of light-emitting elements that are electrically connected to one another in series in each group and that are arranged between the first electrode and the second electrode, a first light-transmitting member including a first phosphor and covering at least one light-emitting element and a second light-transmitting member including a second phosphor and covering at least one light-emitting element that is uncovered by the first light-transmitting member, the first phosphor in the first light-transmitting member and the second phosphor in the second light-transmitting member being configured to be excited to emit light with emission spectrum different from each other, and the first light-transmitting member being enclosed by the second light-transmitting member.

Abstract: A planar light-emitting device includes a first reflecting surface, a rectangular support disposed adjacent to the first reflecting surface, light sources each including a light-emitting surface and disposed along, at least one side portion of the rectangular support, and a lens including a light-receiving surface disposed to face the light-emitting surfaces of the light sources, and configured to introduce light emitted from the light sources into a space that is demarcated by at least the first reflecting surface and the rectangular support.

Abstract: A layered substrate includes a first substrate including an upper surface, a lower surface, a peripheral surface between peripheral edges of the upper surface and the lower surface, and a cut portion cut into the peripheral surface and passing through the upper surface and the lower surface, and a second substrate including an upper surface, a lower surface, and a peripheral surface between peripheral edges of the upper surface and the lower surface, and the lower surface of the second substrate layered on the upper surface of the first substrate and closing the cut portion of the first substrate from above. The second substrate includes a heat conductor that is thermally connected to an element to be mounted on the upper surface of the second substrate, the heat conductor configured to thermally extend to the cut portion of the first substrate.

Abstract: Providing a lighting device wherein provisions are made to be able to provide a sufficiently high dielectric strength while retaining the required heat-sink property even when a module substrate with a plurality of LED elements mounted thereon is reduced in size. A lighting device includes a module substrate on an upper surface of which are mounted a plurality of LED elements, a heat-sink member, having a raised portion, for dissipating heat generated by the plurality of LED elements, and an insulating sheet formed with an opening and interposed between a portion of the lower surface of the module substrate and the heat-sink member, and wherein the raised portion is formed so as to be located via the opening in close proximity to the lower surface of a region where the plurality of LED elements are mounted on the module substrate.

Abstract: The present invention is an LED unit having a thermal-release structure including a base having high thermal conductivity, a circuit board which includes a wiring pattern and is provided on the base, at least one LED element which is electrically connected to the wiring pattern and disposed on the base, and a light-transmitting resinous body provided to cover above the base to seal the LED element.