Patents Assigned to CJ TECHNOLOGY CO., LTD.
  • Adhesive for joining metals and resins, its adhesive layer and application thereof
    Patent number: 11639454
    Abstract: An adhesive for joining metals and resins is disclosed. The adhesive comprises 0.0001˜3 wt. % of amino silane, 0.0001˜1 wt. % of a crosslinker and 0.0001˜3 wt. % of an organometallic compound. In particular, the adhesive forms an adhesive layer that has a metal atomic ratio less than 50%.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: May 2, 2023
    Assignee: CJ TECHNOLOGY CO., LTD.
    Inventors: Tse Wei Yu, Hao-Han Fan
  • Silicon etchant with high Si/SiO2 etching selectivity and application thereof
    Patent number: 11084981
    Abstract: A silicon etchant with high Si/SiO2 etching selectivity and its application are disclosed. The silicon etchant comprises at least one ketal and at least one quaternary ammonium hydroxide compound. The weight percentage of the ketal is 20˜99 wt. % based on the total weight of the etchant and the weight percentage of the quaternary ammonium hydroxide compound is 0.1˜10 wt. % based on the total weight of the etchant.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: August 10, 2021
    Assignee: CJ TECHNOLOGY CO., LTD.
    Inventor: Mo Hsun Tsai