Abstract: Process for the preparation of a 2-(n-alkyl)-3-(4-hydroxybenzoyl)benzofuran of formula (I) in which R represents a linear or branched alkyl radical including from 1 to 5 carbon atoms and R1 represents a linear or branched alkyl radical including from 1 to 3 carbon atoms, a linear or branched alkoxy radical including from 1 to 3 carbon atoms, a halogen atom or a nitro radical, and intermediates.

Abstract: Resin compositions, methods of forming such resin compositions, methods of using such resin compositions and substrates treated with such resin compositions are disclosed. One of such resin compositions contains no formaldehyde and is useful as a binder. Such resin composition comprises the reaction product of: a—melamine, b—at least one aldehyde of formula (1) as defined in the specification, c—a cross linking agent, wherein the cross linking agent is glyoxylic acid, and d—at least one polyol having 2 or more than 2 hydroxyl groups. The resin composition of the present invention can provide performance characteristics to which they are applied.

Abstract: Process for the preparation of primary amines of formula (I): where R3 represents an alkyl, cycloalkyl or aralkyl group, by reaction of a triazolium salt of formula (II): where R1 and R2 represent hydrogen or an alkyl, aralkyl or aryl group, R4 represents an alkyl or aralkyl group or a residue of an organic polymer functionalized by an alkylating group, and A? represents a halogen, alkylsulphonate, arylsulphonate, alkyl sulphate, hydrogensulphate, hemisulphate, perchlorate or hydroxide, with a hydride, in order to obtain an amine of formula (I), which is isolated, if desired, and intermediates.

Abstract: The invention relates to a method for separating a diacetal of the glyoxal of a raw mixture comprising said diacetal of the glyoxal and a monoacetal of the glyoxal, by means of counter-current liquid-liquid extraction.

Abstract: Resin compositions, methods of forming such resin compositions, methods of using such resin compositions and substrates treated with such resin compositions are disclosed. One of such resin compositions contains no formaldehyde and is useful as a binder. Such resin composition comprises the reaction product of: a—melamine, b—at least one aldehyde of formula (1) as defined in the specification, c—a cross linking agent, wherein the cross linking agent is glyoxylic acid, and d—at least one polyol having 2 or more than 2 hydroxyl groups. The resin composition of the present invention can provide performance characteristics to which they are applied.

Abstract: Process for the preparation of primary amines of formula (I): where R3 represents an alkyl, cycloalkyl or aralkyl group, by reaction of a triazolium salt of formula (II): where R1 and R2 represent hydrogen or an alkyl, aralkyl or aryl group, R4 represents an alkyl or aralkyl group or a residue of an organic polymer functionalized by an alkylating group, and A? represents a halogen, alkylsulphonate, arylsulphonate, alkyl sulphate, hydrogensulphate, hemisulphate, perchlorate or hydroxide, with a hydride, in order to obtain an amine of formula (I), which is isolated, if desired, and intermediates.

Abstract: Fluid silico-acrylic compositions, stable in the long term, polymerizable thermally and by radiatiion, by mechanism giving rise to free radicals, with a very low water (less than 1%) and volatile solvent content, containing silica, a silane, and a multifunctional acrylic monomer, in which the silica is in the form of indivualized particles with an average diameter with the range 9 amd 100 nm, not interconnected by siloxane bonds, the silane is a vinyl silane with the formula (I) H2C═CH—Si(OR)3  (I) in which R represents a methyl or ethyl radical, and the multifunctional (meth)acrylic monomer is an alkoxylated (meth)acrylate, method for preparation and use for the development of anti-scratch transparent and uncoloured varnishes, obtained by polymerization giving rise to free radicals by radiation (UV, electron bundles) or thermally.

Abstract: New phenolic compounds of formula (I) R=C3-C17 dialkoxymethyl group, 1,3-dioxolan-2-yl group optionally substituted on peaks 4 and/or 5 by one or more C1-C8 alkyls or 1,3-dioxan-2-yl group optionally substituted on peaks 4 and/or 5 and/or 6 by one or more C1-C8 alkyls. n=1, 2 or 3, the group or groups are in o and/or p position of the OH of the cycle m=from 0 to 4-n, X=functional group such as OH or Hal or C1-C8 alkyl or alkoxy group or C5-C12 aryl group and optionally 1 or 2 heteroatoms such as N or O, or carboxy or —CO—Y group where Y=C1-C8 alkyl or alkoxy or amido or amino or thiol group, on condition that at least one of the ortho or para positions of the phenolic cycle is substituted by a hydrogen, and their salts with the alkali metals, alkaline-earth metals and amines.

Abstract: A product corresponding to formula (I) or its ketonic tautomer form (II) which is 3-(1-hydroxy-pentylidene)-5-nitro-3H-benzofuran-2-one, a process for the preparation and use of the product corresponding to formula (I) or its tautomeric form (II), a process for the preparation and use, particularly for the production of synthesis intermediates.

Abstract: Process for mechanical chemical polishing of a layer of an aluminium or aluminium alloy conducting material used in the microelectronics semi-conductors industry in which said aluminium or aluminium alloy layer is abraded using an abrasive composition which comprises an alkaline aqueous suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, a tetraalkylammonium hydroxide and an oxidizing agent.

Abstract: A composition for mechanical chemical polishing of a layer in an insulating material based on a polymer with a low dielectric constant, comprising an acid aqueous suspension of cationized colloidal silica containing individualized colloidal silica particles not linked to each other by siloxane bonds and water as the suspension medium, process for mechanical chemical polishing of a layer of insulating material based on a polymer with a low dielectric constant and abrasive for the mechanical chemical polishing of a layer of insulating material based on a polymer with a low dielectric constant.

Abstract: Fluid silico-acrylic compositions, which can be polymerised by heat and radiation, by radical-type mechanism, with very low water (less than 1%) and volatile solvent content, containing silica, a silane and a multifunctional acrylic monomer, in which the silica is in the form of individualised particles, with a mean diameter of between 40 and 100 nm, not linked to each other by siloxane bonds, and the silane is a vinylsilane of formula (I) H2C═CH—Si(OR)3  (I) in which R represents a methyl or ethyl radical and the multifunctional acrylic monomer is 1,6-hexanediol diacrylate, and which are transparent, colourless and stable over time.

Abstract: Process for mechanical chemical polishing of a layer in a copper-based material using a polishing composition, characterized in that said polishing composition comprises an aqueous suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, the average diameter of which is comprised between 10 and 100 nm, the pH of the aqueous suspension being comprised between 1 and 5.

Abstract: Fluid silico-acrylic compositions, stable in the long term, polymerizable thermally and by radiatiion, by mechanism giving rise to free radicals, with a very low water (less than 1%) and volatile solvent content, containing silica, a silane, and a multifunctional acrylic monomer, in which the silica is in the form of indivualized particles with an average diameter with the range 9 amd 100 nm, not interconnected by siloxane bonds, the silane is a vinyl silane with the formula (I)

Abstract: New phenolic compounds of formula (I) 1

Abstract: Process for finishing a cellulose-based textile according to which the textile is treated using an aqueous finishing bath containing the following cross-linking composition as a cross-linking agent for cellulose: a) 15-95 molar % of at least one maleic acid and hypophosphorus acid telomer of formula (I)  with  and (m+n)≧3  or A=H or OH and n≧2 b) 0-50 molar % phosphinicosuccinic acid c) 0-40 molar % of phosphinicobissuccinic acid d) 0-50 molar % phosphonosuccinic acid e) 0-15 molar % hypophosphorus acid f) 0-10 molar % phosphorus acid g) 0-15 molar % phosphoric acid each of the acids a) to g) of the composition being able to be present either in free form or partially or totally neutralized in the form of an alkali metal or alkaline-earth metal ammonium or amine salt and finishing bath.

Abstract: A product corresponding to formula (I) or its ketonic tautomer form (II) 1

Abstract: Silicoacrylic compositions which are fluid, polymerizable thermally or by radiation, by a radicular mechanism, with a very low water (less than 1.5%) and volatile solvent content containing silica, a silane and a multifunctional acrylic monomer, in which the silica is in the form of individualized particles, with an average diameter comprised between 5 and 100 nm, not linked together with siloxane bonds, the silane is a vinylsilane of formula (1)H.sub.2 C.dbd.CH--Si(OR).sub.3 (I)in which R represents a methyl or ethyl radical, in which the multifunctional acrylic monomer is tripropylene glycol diacrylate designated TPGDA, the quantity of vinylsilane of formula I is comprised between 0.01 millimole and 0.1 millimole per m.sup.2 of silica used and which are transparent and colourless as water and stable over time and preparation process.

Abstract: Chemical mechanical polishing process for a layer of semiconductor material such as polycrystalline silicon, epitaxial single-crystal silicon, amorphous silicon or an isolating material such as phosphosilicate glass or borophosphosilicate glass used in the microelectronics semiconductors industry, with the exception of the initial silicon used in the manufacture of wafers for integrated circuits, in which an abrasion of the layer of semiconductor material or isolating material is carried out by rubbing the said layer with a fabric impregnated with an abrasive composition, the abrasive consisting of an aqueous suspension having a neutral pH or a pH close to neutrality of individualised colloidal silica particles, not linked together by siloxane bonds, and water as the suspension medium.

Abstract: A product corresponding to formula (I) or its ketonic tautomer form (II) which is 3-(1-hydroxy-pentylidene)-5-nitro-3H-benzofuran-2-one, a process for the preparation and use of the product corresponding to formula (I) or its tautomeric form (II), a process for the preparation and use, particularly for the production of synthesis intermediates.