Abstract: A product corresponding to formula (I) or its ketonic tautomer form (II) which is 3-(1-hydroxy-pentylidene)-5-nitro-3H-benzofuran-2-one, a process for the preparation and use of the product corresponding to formula (I) or its tautomeric form (II), a process for the preparation and use, particularly for the production of synthesis intermediates.

Abstract: Process for mechanical chemical polishing of a layer of an aluminium or aluminium alloy conducting material used in the microelectronics semi-conductors industry in which said aluminium or aluminium alloy layer is abraded using an abrasive composition which comprises an alkaline aqueous suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, a tetraalkylammonium hydroxide and an oxidizing agent.

Abstract: A composition for mechanical chemical polishing of a layer in an insulating material based on a polymer with a low dielectric constant, comprising an acid aqueous suspension of cationized colloidal silica containing individualized colloidal silica particles not linked to each other by siloxane bonds and water as the suspension medium, process for mechanical chemical polishing of a layer of insulating material based on a polymer with a low dielectric constant and abrasive for the mechanical chemical polishing of a layer of insulating material based on a polymer with a low dielectric constant.

Abstract: Fluid silico-acrylic compositions, which can be polymerised by heat and radiation, by radical-type mechanism, with very low water (less than 1%) and volatile solvent content, containing silica, a silane and a multifunctional acrylic monomer, in which the silica is in the form of individualised particles, with a mean diameter of between 40 and 100 nm, not linked to each other by siloxane bonds, and the silane is a vinylsilane of formula (I) H2C═CH—Si(OR)3  (I) in which R represents a methyl or ethyl radical and the multifunctional acrylic monomer is 1,6-hexanediol diacrylate, and which are transparent, colourless and stable over time.

Abstract: Process for mechanical chemical polishing of a layer in a copper-based material using a polishing composition, characterized in that said polishing composition comprises an aqueous suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, the average diameter of which is comprised between 10 and 100 nm, the pH of the aqueous suspension being comprised between 1 and 5.

Abstract: Fluid silico-acrylic compositions, stable in the long term, polymerizable thermally and by radiatiion, by mechanism giving rise to free radicals, with a very low water (less than 1%) and volatile solvent content, containing silica, a silane, and a multifunctional acrylic monomer, in which the silica is in the form of indivualized particles with an average diameter with the range 9 amd 100 nm, not interconnected by siloxane bonds, the silane is a vinyl silane with the formula (I)

Abstract: New phenolic compounds of formula (I) 1

Abstract: Process for finishing a cellulose-based textile according to which the textile is treated using an aqueous finishing bath containing the following cross-linking composition as a cross-linking agent for cellulose: a) 15-95 molar % of at least one maleic acid and hypophosphorus acid telomer of formula (I)  with  and (m+n)≧3  or A=H or OH and n≧2 b) 0-50 molar % phosphinicosuccinic acid c) 0-40 molar % of phosphinicobissuccinic acid d) 0-50 molar % phosphonosuccinic acid e) 0-15 molar % hypophosphorus acid f) 0-10 molar % phosphorus acid g) 0-15 molar % phosphoric acid each of the acids a) to g) of the composition being able to be present either in free form or partially or totally neutralized in the form of an alkali metal or alkaline-earth metal ammonium or amine salt and finishing bath.

Abstract: Silicoacrylic compositions which are fluid, polymerizable thermally or by radiation, by a radicular mechanism, with a very low water (less than 1.5%) and volatile solvent content containing silica, a silane and a multifunctional acrylic monomer, in which the silica is in the form of individualized particles, with an average diameter comprised between 5 and 100 nm, not linked together with siloxane bonds, the silane is a vinylsilane of formula (1)H.sub.2 C.dbd.CH--Si(OR).sub.3 (I)in which R represents a methyl or ethyl radical, in which the multifunctional acrylic monomer is tripropylene glycol diacrylate designated TPGDA, the quantity of vinylsilane of formula I is comprised between 0.01 millimole and 0.1 millimole per m.sup.2 of silica used and which are transparent and colourless as water and stable over time and preparation process.

Abstract: Chemical mechanical polishing process for a layer of semiconductor material such as polycrystalline silicon, epitaxial single-crystal silicon, amorphous silicon or an isolating material such as phosphosilicate glass or borophosphosilicate glass used in the microelectronics semiconductors industry, with the exception of the initial silicon used in the manufacture of wafers for integrated circuits, in which an abrasion of the layer of semiconductor material or isolating material is carried out by rubbing the said layer with a fabric impregnated with an abrasive composition, the abrasive consisting of an aqueous suspension having a neutral pH or a pH close to neutrality of individualised colloidal silica particles, not linked together by siloxane bonds, and water as the suspension medium.

Abstract: In an industrial process for the manufacture of sodium orthohydroxymandelate by condensation of phenol in an inert atmosphere with glyoxylic acid in aqueous solution, in the presence of a tertiary amine and of catalytic quantities of a trivalent metal cation at a temperature below 100.degree. C., carried out continuously in at least two reactors (R1 . . .