Patents Assigned to Clear Shape Technologies, Inc.
  • Patent number: 7360191
    Abstract: Systems and methods for timing-driven shape closure in integrated circuit (“IC”) fabrication are provided. These Integrated Design-Manufacturing Processes (“IDMP”) include a delta flow that integrates information of the IC fabrication timing and geometry verification processes into the IC design. The delta flow is an incremental flow that includes delta-geometry timing prediction processes and/or delta-timing shape prediction processes for processing difference information associated with circuit characterization parameters. The delta flow independently re-characterizes an IC design using the difference or delta information corresponding to the circuit characterization parameters. The delta flow provides delta outputs (incremental) that enhance or re-characterize corresponding parameters of the devices and interconnect structures without the need to generate new circuit characterization parameters and without the need to re-process all information of the IC design.
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: April 15, 2008
    Assignee: Clear Shape Technologies, Inc.
    Inventors: Li-Fu Chang, Yao-Ting Wang, Fang-Cheng Chang
  • Patent number: 7216320
    Abstract: Systems and methods for timing-driven shape closure in integrated circuit (“IC”) fabrication are provided. These Integrated Design-Manufacturing Processes (“IDMP”) include a delta flow that integrates information of the IC fabrication timing and geometry verification processes into the IC design. The delta flow is an incremental flow that includes delta-geometry timing prediction processes and/or delta-timing shape prediction processes for processing difference information associated with circuit characterization parameters. The delta flow independently re-characterizes an IC design using the difference or delta information corresponding to the circuit characterization parameters. The delta flow provides delta outputs (incremental) that enhance or re-characterize corresponding parameters of the devices and interconnect structures without the need to generate new circuit characterization parameters and without the need to re-process all information of the IC design.
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: May 8, 2007
    Assignee: Clear Shape Technologies, Inc.
    Inventors: Li-Fu Chang, Yao-Ting Wang, Fang-Cheng Chang