Abstract: One embodiment of the present invention is a heat sink apparatus for cooling a semiconductor device includes: (a) a rigid support ring having a top surface and a bottom surface; (b) a thermally conductive bottom sheet having a top and a bottom surface, wherein the top surface of the sheet is attached to the bottom surface of the rigid support ring; and (c) a channel for cooling fluid formed by a volume contained by the rigid support ring, the sheet, and an enclosure; wherein the sheet is held in tension by the rigid support ring, thereby reducing the macroscopic coefficient of thermal expansion (CTE) of the sheet. In use, thermally induced mechanical stress in a semiconductor device attached to the bottom surface of the sheet may be ameliorated by the reduction in macroscopic CTE, thereby increasing reliability of an assembly as it is cycled in temperature during normal operation.

Abstract: One embodiment of the present invention is an apparatus for cooling a microelectronic device including: (a) a rigid support ring having a top surface and a bottom surface; (b) a mechanically resilient, thermally conductive bottom membrane having a top and a bottom surface, wherein the top surface of the membrane is attached to the bottom surface of the ring; and (c) a multiplicity of thermally conductive posts having top and bottom surfaces, the posts being disposed with their bottom surfaces in thermal contact with the top surface of the bottom membrane over an area, wherein the posts are arrayed in the area with spaces therebetween so that heat transferred from the microelectronic device to the bottom surface of the membrane may be transferred to the multiplicity of thermally conductive posts.

Abstract: One embodiment of the present invention is an apparatus for cooling a microelectronic device including: (a) a rigid support ring having a top surface and a bottom surface; (b) a mechanically resilient, thermally conductive bottom membrane having a top and a bottom surface, wherein the top surface of the membrane is attached to the bottom surface of the ring; and (c) a multiplicity of thermally conductive posts having top and bottom surfaces, the posts being disposed with their bottom surfaces in thermal contact with the top surface of the bottom membrane over an area, wherein the posts are arrayed in the area with spaces therebetween so that heat transferred from the microelectronic device to the bottom surface of the membrane may be transferred to the multiplicity of thermally conductive posts.