Patents Assigned to Clover Electronics Co., Ltd.
  • Patent number: 7457129
    Abstract: There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board 1 includes a first printed wiring board 10 having a semiconductor element 2 mounted on a wiring pattern 12, a second printed wiring board 21 laminated on the wiring pattern 12 through a first insulating layer 20, a third printed wiring board 31 laminated on the second printed wiring board 21 through a second insulating layer 30, and a space region penetrating through the first insulating layer 20 and the second printed wiring board 21 in the thickness direction and adapted so that the semiconductor element 2 can be accommodated therewithin.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: November 25, 2008
    Assignee: Clover Electronics Co., Ltd.
    Inventors: Yoshiyuki Ikezawa, Takeshi Sunada, Tomoyasu Gunji, Katsuhiko Matsuura, Hidetoshi Hiramori, Tetsuya Yasuoka