Abstract: A droplet discharging apparatus has a pressure chamber communicating with a nozzle, a vibration film forming a part of the pressure chamber, a piezoelectric element for vibrating the vibration film, a projection joined to the piezoelectric element and transmitting vibration of the piezoelectric element to the vibration film, and a flow path communicating with the pressure chamber. The apparatus has first and second members, with the vibration film, the projection, a groove, and a supply hole communicating with the groove being provided at the first member. The nozzle and the pressure chamber are formed in the second member. The first member and the second member are bonded together to form the flow path in the groove and also the pressure chamber in the recess. The groove and the recess partially overlap to form the flow path and the pressure chamber. A method is disclosed for manufacturing the droplet discharging apparatus.

Abstract: A wiring circuit board and a method of producing the same are provided in which a desired pattern of wiring is provided at higher density while permitting no overflow from the grooves of an electroless plating catalyst containing solution and an electric conductor forming liquid such as silver ink. The pattern of electric conductor is deposited by applying the electric conductor forming liquid into the grooves provided in a substrate and distributing the same along the grooves with the action of capillarity. The method starts with patterning the grooves in the surface of the substrate (S1), applying the electric conductor forming liquid into the grooves (S2), and coating the surface of the substrate with a layer of repellent liquid which is lower in the affinity with the electric conductor forming liquid (S3). This is followed by cleaning at least the grooves (S4) and then filling the grooves with the electric conductor forming liquid once again (S5).

Abstract: The present invention provides a resin composition suitable for molding a microscopic structure that has small cure shrinkage, good mold transfer properties and excellent properties for post-processing such as polishing processing and laser processing. Such a resin is a thermosetting resin composition comprising 95 to 35 wt % of a thermosetting resin and 5 to 65 wt % of organic filler having a particle size of 10 ?m or less. From such a resin, an ink ejecting apparatus having a microscopic structure, for example, a nozzle of a diameter of 30 ?m, is integrally molded.