Patents Assigned to CMC MATERIALS LLC
  • Chemical mechanical planarization pads with constant groove volume
    Patent number: 11938584
    Abstract: A chemical mechanical polishing pad includes a surface portion of a first material. The surface portion includes a plurality of grooves. A first portion of the grooves are exposed grooves located at a surface of the chemical mechanical polishing pad. A second portion of the grooves are buried grooves embedded below the surface of the chemical mechanical polishing pad, such that, during use of the chemical mechanical polishing pad, one or more of the buried grooves are exposed at the surface.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: March 26, 2024
    Assignee: CMC MATERIALS LLC
    Inventors: Paul Andre Lefevre, Devin Schmitt, Jaeseok Lee, Eric S. Moyer, Holland Hodges