Patents Assigned to CMC Wireless Components, Inc.
  • Die attachment utilizing grooved surfaces
    Patent number: 6399182
    Abstract: A substrate for a microelectronic package comprising a substrate that has grooves on a surface for bonding. A method for preparing a substrate for bonding comprising forming a grooved surface in the substrate for accepting a die for bonding, wherein the grooves are of sufficient size to provide a substantially uniform die bond, but no so large as to nullify the thermal path to the underlying substrate.
    Type: Grant
    Filed: April 12, 2000
    Date of Patent: June 4, 2002
    Assignee: CMC Wireless Components, Inc.
    Inventors: Erich K. Rubel, Jonathan H. Harris, Gabriel M. Carrasco