Patents Assigned to CML Innovative Technologies
  • Patent number: 7938692
    Abstract: The present invention relates to a battery connection with an anti-locking system including a casing for connection of the electric cables furnished with a lever articulated between a locked position and an unlocked position. The connection has an anti-locking system preventing the lowering of the lever and hence the locking of the connection on the battery terminal, if the interlocking is not correctly achieved. The anti-locking system includes a detector that can be moved between two configurations which correspond to the locked position and to the unlocked position of the connection and is suitable, in the configuration corresponding to the locked position, for pressing against a surface of the battery containing the battery terminal.
    Type: Grant
    Filed: May 24, 2007
    Date of Patent: May 10, 2011
    Assignee: CML Innovative Technologies
    Inventor: Jean-Marie Vejux
  • Publication number: 20090280699
    Abstract: The present invention relates to a battery connection with an anti-locking system including a casing for connection of the electric cables furnished with a lever articulated between a locked position and an unlocked position. The connection has an anti-locking system preventing the lowering of the lever and hence the locking of the connection on the battery terminal, if the interlocking is not correctly achieved. The anti-locking system includes a detector that can be moved between two configurations which correspond to the locked position and to the unlocked position of the connection and is suitable, in the configuration corresponding to the locked position, for pressing against a surface of the battery containing the battery terminal.
    Type: Application
    Filed: May 24, 2007
    Publication date: November 12, 2009
    Applicant: CML INNOVATIVE TECHNOLOGIES
    Inventor: Jean-Marie Vejux
  • Patent number: 7488097
    Abstract: An LED lamp module designed to be easily retrofitted into existing incandescent based light fixtures with minimum modification is provided. The LED lamp module includes a generally circular metal core board including a first surface and a second surface; at least one LED disposed centrally on the first surface of the metal core board; and a flat annular printed circuit board including a current driver circuit for powering the at least one LED, the annular printed circuit board being disposed around the at least one LED and electrically coupled to the at least one LED, wherein the second surface of the metal core board is configured to contact a host fixture and heat generated by the at least one LED is conducted to the host fixture. The LED lamp module uses the host light fixture as a heat sink to transfer and dissipate heat to the external environment.
    Type: Grant
    Filed: June 26, 2006
    Date of Patent: February 10, 2009
    Assignee: CML Innovative Technologies, Inc.
    Inventors: William Reisenauer, Wojciech Pawelko
  • Patent number: 7435143
    Abstract: A device for holding and for the connection of optoelectronic components, such as light-emitting diodes (LED's) of the PLCC2 and PLCC4 type, is formed from a body made of plastic coupled with a metal cluster. The metal cluster includes a contact arm and a positioning arm having a cooperating spigot for positioning and holding the LED's, and for ensuring electrical contact with the electrodes of the LED's.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: October 14, 2008
    Assignee: CML Innovative Technologies
    Inventor: Daniel Anderlini
  • Patent number: 7062112
    Abstract: A temperature resistant waveguide is mounted to an SMT LED package to provide a complete module that can withstand temperatures found in a solder reflow process without deformation or damage. The waveguide is composed of a high temperature thermoplastic and is coupled to the LED using automated equipment with optical markings for precise positioning and construction. The SMT LED module is automatically located on a printed circuit board and exposed to temperatures for a solder reflow process. The high temperature thermoplastic does not deform during the solder reflow process, thereby providing a robust SMT LED module that can be automatically manufactured and placed on a printed circuit board, without additional steps or human intervention.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: June 13, 2006
    Assignee: CML Innovative Technologies, Inc.
    Inventor: Norman Simms
  • Patent number: D532026
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: November 14, 2006
    Assignee: CML Innovative Technologies, Inc.
    Inventors: Krzysztof Sosniak, Robert H. Hanes, Michael Rehberger, Gerard Lagadec
  • Patent number: D691964
    Type: Grant
    Filed: August 3, 2012
    Date of Patent: October 22, 2013
    Assignee: CML Innovative Technologies
    Inventor: Rémy Cuche