Abstract: Inductive structures make highly efficient use of the magnetic flux generd, and are consistent with integrated circuit manufacturing techniques. The structures include electrically conductive layers and interconnecting conductor filled vias to define a helical winding surrounding a closed magnetic core. The magnetic core may also be formed by semiconductor manufacturing techinuqes. A method of making the structures on a semiconductor substrate concurrently with the formation of the integrated circuit itself is also disclosed.
Type:
Grant
Filed:
December 6, 1996
Date of Patent:
August 10, 1999
Assignees:
SGS-Thomson Microelectronics S.r.L., Co.Ri.M.Me-Consorzio per la Ricera sulla Microelectronia nel.
Inventors:
Piero Capocelli, Raffaele Zambrano, Federico Pio, Carlo Riva