Patents Assigned to CO
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Publication number: 20200353479Abstract: The present disclosure relates to a fine dust removal system including a conductive filter module, and more particularly, to a fine dust removal system having a conductive filter module which includes a cylindrical conductive filter to thereby implement high fine dust removal efficiency with low pressure loss and which can be easily, generally applied to and used in an air cleaner to be installed in windows or in an independent indoor air cleaner.Type: ApplicationFiled: July 24, 2018Publication date: November 12, 2020Applicant: ALINK CO., LTDInventor: Hye Moon Lee
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Publication number: 20200354096Abstract: A binding machine is configured to bind a bound member by a binder that is plastically deformable. The binding machine includes a driver, a driver mechanism and a clincher. The driver is configured to strike out the binder. The drive mechanism is configured to drive the driver linearly. The clincher is disposed at a position where a tip end portion of the driver is received. An insertion opening into which the bound member is inserted is provided between the driver and the clincher, and a standby portion configured to make the binder stand by is provided between the driver and the insertion opening. When the drive mechanism is actuated, the driver strikes out the binder supplied to the standby portion, and leg portions of the struck binder are pressed against the clincher and deformed.Type: ApplicationFiled: April 26, 2018Publication date: November 12, 2020Applicant: MAX CO., LTD.Inventor: Hajime TAKEMURA
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Publication number: 20200359134Abstract: Embodiments of wireless audio systems and methods for wirelessly communicating audio information are disclosed herein. In one example, a wireless audio system includes a first and a second wireless headphones. The first wireless headphone is configured to receive, from an audio source, audio information using a short-range wireless communication, and in response to successfully receiving the audio information from the audio source, transmit a first error correcting message including an error correcting code generated based on the audio information to a second wireless headphone. The second wireless headphone is configured to receive the audio information from the audio source using the short-range wireless communication, attempt to correct the received audio information based on the first error correcting message, and determine that the received audio information fails to be corrected.Type: ApplicationFiled: May 27, 2019Publication date: November 12, 2020Applicant: BESTECHNIC (SHANGHAI) CO., LTD.Inventors: Weifeng Tong, Liang Zhang, Qianli Ma, Fei Luo
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Publication number: 20200357830Abstract: The present disclosure provides an LTPS type TFT and a method for manufacturing the same. The TFT includes a first contact hole and a second contact hole, where the first contact hole and the second contact hole pass through the third insulating layer, the second insulating layer, and a portion of the first insulating layer, such that a portion of the heavily doped area is exposed. In addition, a transparent electrode is electrically connected to the source/drain electrode or the second gate electrode and a portion of the heavily doped area.Type: ApplicationFiled: July 30, 2020Publication date: November 12, 2020Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.Inventors: Juncheng XIAO, Chao TIAN
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Publication number: 20200353817Abstract: A projection unit is configured to provide at least one of a first image adapted to be presented to the inside of a vehicle and a second image adapted to be presented to the outside of the vehicle. A dimming film is configured to be placed in at least one of a first state in which first light corresponding to the first image is directed to the inside of the vehicle and a second state in which second light corresponding to the second image is directed to the outside of the vehicle. A control unit is configured to place the dimming film in the first state when the first image is provided, and to place the dimming film in the second state when the second image is provided.Type: ApplicationFiled: November 20, 2018Publication date: November 12, 2020Applicant: KOITO MANUFACTURING CO., LTD.Inventors: Yusuke Nakada, Michihiko Hayakawa, Kouhei Murata, Shunsuke Okamura, Jun Iwasaki, Satoshi Yamamura, Takanobu Toyoshima
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Publication number: 20200358031Abstract: A display device and a method of manufacturing the same are provided. A display device includes: a plastic substrate including: a display portion including organic light emitting diodes, and a pad portion including chip-on-films, a lower protective member attached to an entire lower surface of the plastic substrate, and an upper protective member attached to an upper surface of the plastic substrate, the upper protective member covering at least the display portion and both edges of the pad portion.Type: ApplicationFiled: July 23, 2020Publication date: November 12, 2020Applicant: LG Display Co., Ltd.Inventors: Kwonhyung LEE, Chanwoo LEE
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Publication number: 20200357867Abstract: An array substrate and display device are disclosed. The array substrate includes signal lines; IC connection lines; the IC connection lines include at least two IC connection line groups, the at least two IC connection line groups include a first IC connection line group and a second IC connection line group, the base substrate further includes a dummy area, the dummy area is provided with a floating pattern, the dummy area includes a separation area and two sub-dummy areas, an extending line of the signal line corresponding to a first IC connection line and an extending line of the signal line corresponding to a second IC connection line respectively fall into the separation area, at least in the separation area, the floating pattern only includes first floating lines substantially extending along the second direction.Type: ApplicationFiled: July 27, 2020Publication date: November 12, 2020Applicants: Hefei Xinsheng Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Xingxing Song, Zhenfei Cai, Dayong Yu, Kun Yu, Zhongzhen Li, Wenjie Wang
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Method For Controlling Shutdown Wave Blocking Of Multilevel Inverter Circuit And Application Thereof
Publication number: 20200358369Abstract: A method for controlling shutdown wave blocking of a multilevel inverter circuit and an application apparatus for applying the method are provided. After a shutdown command is issued, the multilevel inverter circuit is controlled to switch between a free state and a specific turn-on state. The free state is a state in which all switch tubes in the multilevel inverter circuit are turned off. The specific turn-on state is a state in which voltage stress withstood by a switch tube, on which clamping protection is not performed, in the multilevel inverter circuit is zero by controlling a specific combination of switch tubes in the multilevel inverter circuit to be turned on.Type: ApplicationFiled: December 27, 2019Publication date: November 12, 2020Applicant: SUNGROW POWER SUPPLY CO., LTD.Inventors: Jiacai ZHUANG, Jun XU, Bing ZHANG, Peng WEN, Peng WANG -
Publication number: 20200357699Abstract: A collector layer, a base layer, an emitter layer, and an emitter mesa layer are placed above a substrate in this order. A base electrode and an emitter electrode are further placed above the substrate. The emitter mesa layer has a long shape in a first direction in plan view. The base electrode includes a base electrode pad portion spaced from the emitter mesa layer in the first direction. An emitter wiring line and a base wiring line are placed on the emitter electrode and the base electrode, respectively. The emitter wiring line is connected to the emitter electrode via an emitter contact hole. In the first direction, the spacing between the edges of the emitter mesa layer and the emitter contact hole on the side of the base wiring line is smaller than that between the emitter mesa layer and the base wiring line.Type: ApplicationFiled: May 7, 2020Publication date: November 12, 2020Applicant: Murata Manufacturing Co., Ltd.Inventors: Yasunari UMEMOTO, Shigeki KOYA, Isao OBU, Kaoru IDENO
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Publication number: 20200359496Abstract: A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.Type: ApplicationFiled: July 30, 2020Publication date: November 12, 2020Applicant: Delta Electronics (Shanghai) CO., LTDInventors: Shouyu HONG, Zhiheng FU, Haoyi YE, Qingdong CHEN, Yiqing YE, Jinping ZHOU, Xiaoni XIN, Pengkai JI, Min ZHOU
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Publication number: 20200354425Abstract: The present invention relates to a novel peptide analog of acylated oxyntomodulin and a pharmaceutical composition comprising the same for preventing and treating obesity or overweightness, or diabetes accompanied by obesity and overweightness. The peptides are superior to those of natural oxyntomodulin in dual agonism on GLP-1 and glucagon receptors and longer in vivo half-life. A pharmaceutical composition comprising said peptides is effective in the treatment of metabolic diseases such as obesity and diabetes mellitus.Type: ApplicationFiled: August 16, 2018Publication date: November 12, 2020Applicant: DONG-A ST CO., LTD.Inventors: Jae-Sung YANG, Kyung-Seok LEE, Yu-Na CHAE, Gye-Rim BAEK, Tae-Hyoung KIM, Ill-Hun JUNG, Chae-Lim RYU, Weon-Bin IM
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Publication number: 20200354988Abstract: A door lock for a domestic electrical appliance comprises a movably arranged locking member, which is selectively adjustable into an unlocking position and a locking position and in the unlocking position permits the opening of a closed door of the domestic appliance and in the locking position is in blocking engagement with a blockable component, at least when the door is closed. The blocking engagement causes the closed door to be blocked against opening. The door lock further comprises an electrically controllable actuator for actuating the locking member, and an electrical door detection switch that switches depending on the closing of the door. The doer lock also comprises an electrical auxiliary switch device, which selectively opens or closes an electrical shunt path to the door detection switch depending on the position of the locking member.Type: ApplicationFiled: May 7, 2020Publication date: November 12, 2020Applicant: emz-Hanauer GmbH & Co. KGaAInventors: Albert Dirnberger, Markus Lang, Georg Spiessl, Robert Reitinger
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Publication number: 20200358041Abstract: A display panel, a manufacturing method thereof, and a display device. The manufacturing method includes: providing a pretreatment solution containing a water-soluble organic protective agent, and forming, on an anode, a solution layer covering the anode; drying the solution layer to form an adhesive layer; removing the adhesive layer; and drying the anode; where the pretreatment solution contains 10-30% by weight of propylene glycol methyl ether and 70-90% by weight of water.Type: ApplicationFiled: July 29, 2020Publication date: November 12, 2020Applicant: YUNGU (GU'AN) TECHNOLOGY CO., LTD.Inventors: Shengfang LIU, Ying HUANG, Xueyuan LI, Ping ZHU, Lei LV, Yibo ZHANG
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Publication number: 20200357775Abstract: A light-emitting apparatus and a method for manufacturing the same are provided in which heat dissipation from an LED package to a heat sinking substrate is improved while electrical insulation therebetween is ensured. The light-emitting apparatus includes a circuit board having an opening, an LED package inserted into the opening from the back side of the circuit board and having an edge connected to the back side of the circuit board, and a heat sinking substrate disposed on the back side of the circuit board so as to be in contact with the LED package.Type: ApplicationFiled: May 30, 2017Publication date: November 12, 2020Applicants: Citzen Electronics Co., Ltd., Citzen Watch Co., Ltd.Inventors: Koki HIRASAWA, Nodoka OYAMADA, Yuji OMORI
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Publication number: 20200357856Abstract: A display apparatus includes a substrate including a display area configured by a plurality of emission areas and a non-emission area between the plurality of emission areas; an encapsulation part which covers a display area; a touch part including a plurality of insulating layers disposed on the encapsulation part and a touch line in the non-emission area; and a plurality of light extraction patterns disposed between the touch line and the plurality of emission areas, in which the plurality of light extraction patterns includes grooves at at least a portion of the plurality of insulating layers.Type: ApplicationFiled: April 15, 2020Publication date: November 12, 2020Applicant: LG Display Co., Ltd.Inventors: Wonhoe KOO, Dongmin SIM, Kyunghoon HAN
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Publication number: 20200357824Abstract: An array substrate and a display panel are proposed. Each of the signal conversion lines of the array substrate extends in the first direction, and connects two connection terminals adjacent to the each of signal conversion lines. Projections of the connection terminals on the reference plane in the second direction do not overlap. In this manner, the design that the adjacent connection terminals are interlaced can increase the spacing between the adjacent connection terminals, thus resolving the problem that the spacing between connection terminals on the array substrate is excessively small and short circuiting tends to happen when bonding to cause poor bonding in the related art.Type: ApplicationFiled: April 12, 2019Publication date: November 12, 2020Applicant: Wuhan China Star Optoelectronics Semieconductor Display Technology Co., Ltd.Inventors: Chaoyu YUAN, Min CHEN
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Publication number: 20200358063Abstract: The secondary battery cells are disposed in parallel in such postures that side surfaces of cylindrical shapes face each other in an internal space of a housing case, and are separated from each other with a longitudinal partition plate interposed between the secondary battery cells. A pair of ribs are provided on an inner surface of the housing case to hold the longitudinal partition plate. The longitudinal partition plate disposed between the pair of ribs is held in the housing case. A gap between the pair of ribs and the longitudinal partition plate is filled with a flame-retardant adhesive material.Type: ApplicationFiled: December 11, 2018Publication date: November 12, 2020Applicant: SANYO Electric Co., Ltd.Inventors: Manabu Tada, Yuki Takatsuji, Ryusuke Tsujiguchi, Michinobu Ono
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Publication number: 20200357291Abstract: Operation history information on every aircraft can be collected, and efficiency in collection of the aircraft operation history information can be improved. The present invention includes: an image acquisition unit 11 configured to acquire an image G obtained by imaging a route R or A2; an image-type model identification unit 21 configured to identify a model of an aircraft P in the route R or A2 based on appearance data of an aircraft Q in the image G acquired by the image acquisition unit 11 and aircraft appearance samples previously prescribed for respective models; and an operation history storage unit 45 configured to store image-derived model information identified by the image-type model identification unit 21.Type: ApplicationFiled: December 19, 2017Publication date: November 12, 2020Applicant: Nihon Onkyo Engineering Co., Ltd.Inventors: Yoshio Tadahira, Osamu Kohashi, Hiroshi Wada, Takahiro Mizuno, Kazuki Tamura
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Publication number: 20200359500Abstract: A wiring board for a built-in electronic component includes a first insulating layer, a second insulating layer formed under the first insulating layer, and a conductor layer formed on an upper surface of the second insulating layer such that a cavity is formed to penetrate through the first insulating layer and the conductor layer and expose the second insulating layer at a bottom of the cavity and is formed to accommodate an electronic component therein. The first insulating layer and the conductor layer are formed such that the cavity has a first inner side surface extending from an upper opening edge to a position closer to the second insulating layer, and a lateral expansion part formed between a lower edge of the first inner side surface and the second insulating layer and extending outward from the lower edge of the first inner side surface.Type: ApplicationFiled: May 11, 2020Publication date: November 12, 2020Applicant: IBIDEN CO., LTD.Inventors: Yusuke TANAKA, Tomohiro FUTATSUGI, Yuichi NAKAMURA, Yoshiki MATSUI
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Publication number: 20200359481Abstract: An operating circuit has a supply circuit that is connected to a supply voltage and that has a first converter circuit. The supply circuit is connected to a power stage through an intermediate circuit with an energy storage to buffer an intermediate circuit voltage. The power stage has a second converter circuit. The output side of the power stage has the at least one illuminant connected to it. A desired dimming level is specified through a dimming input signal. Depending on the dimming input signal, the power stage is actuated by means of a dimming control signal to adjust the lighting power. The dimming control signal or a signal characterizing the dimming control signal is taken into consideration in the controller of the supply circuit, to keep the intermediate circuit voltage within a specified voltage range.Type: ApplicationFiled: April 21, 2017Publication date: November 12, 2020Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Elmar HINRICHS, Michael KOLB