Patents Assigned to CO
  • Patent number: 10559687
    Abstract: A semiconductor device including a substrate; a first and second active region on the substrate; a first recess intersecting with the first active region; a second recess intersecting with the second active region; a gate spacer extending along sidewalls of the first and second recess; a first lower high-k dielectric film in the first recess and including a first high-k dielectric material in a first concentration and a second high-k dielectric material; a second lower high-k dielectric film in the second recess and including the first high-k dielectric material in a second concentration that is greater than the first concentration, and the second high-k dielectric material; a first metal-containing film on the first lower high-k dielectric film and including silicon in a third concentration; and a second metal-containing film on the second lower high-k dielectric film and including silicon in a fourth concentration that is smaller than the third concentration.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Yeol Song, Su Young Bae, Dong Soo Lee, Hyung Suk Jung, Sang Jin Hyun
  • Patent number: 10560246
    Abstract: To solve the above-mentioned problem, the method for transmitting and receiving a signal by user equipment (UE) through one or more cells, according to one embodiment of the present specification, comprises the steps of: receiving, from a base station, a first message indicating whether one or more cells usable by the UE are enabled; determining which cells to enable or disable on the basis of the first message; and enabling or disabling the selected cells. According to the embodiment of the present specification, by aggregating carriers amongst different base stations, a possibility for the UE to transmit and receive high-speed data through carrier aggregation can increase.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: February 11, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Soeng Hun Kim, Gert Jan Van Lieshout, Sang Bum Kim, Kyeong In Jeong
  • Patent number: 10557198
    Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes a substrate chuck, a shower head structure over the substrate chuck, and a gas distribution apparatus connected to the shower head structure. The gas distribution apparatus includes a dispersion container including a first dispersion space and a gas inlet section on the dispersion container. The gas inlet section includes a first inlet pipe including a first inlet path fluidly connected to the first dispersion space and a second inlet pipe including a second inlet path fluidly connected to the first dispersion space. The second inlet pipe surrounds at least a portion of a sidewall of the first inlet pipe.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: February 11, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Heon Bok Lee, Dae Yong Kim, Dong Woo Kim, Jun Ki Park, Sang Yub Ie, Sang Jin Hyun
  • Patent number: 10559535
    Abstract: The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: February 11, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Yoshihisa Masuda, Hideo Nakagoshi, Yuta Morimoto, Norio Sakai, Yoriyuki Matsumoto, Hiroaki Tsuchida
  • Patent number: 10558896
    Abstract: A method and an electronic device are disclosed. The method includes obtaining an image, obtaining information of the image, obtaining content information of content included in the image, obtaining related information which relates to the image based on at least one of the information of the image and the content information, and classifying the image into at least one category based on a plurality of defined information/data elements and a relation among the information/data elements and metadata of the image.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: February 11, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo-Chan Kim, Jun-Seok Heo
  • Patent number: 10557547
    Abstract: A hydraulic control device includes: a pressure regulation valve that regulates a hydraulic pressure of oil supplied from an oil pump; a discharge oil passage through which the oil discharged from a fluid coupling flows when a lockup clutch is disengaged; a lubrication oil passage that supplies the oil from the discharge oil passage to a location to be lubricated; a return oil passage that returns the oil drained from the pressure regulation valve to a suction port of the oil pump; a connection oil passage that connects the lubrication oil passage and the return oil passage; and a flow direction regulation valve that is provided in the connection oil passage.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: February 11, 2020
    Assignees: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenichi Tsuchida, Toshiaki Hayashi, Yoichiro Kimura, Syuji Moriyama, Yoshinobu Soga, Hiromitsu Nitani, Takafumi Inagaki, Tetsuya Yamamoto
  • Patent number: 10558826
    Abstract: Provided are a method and an apparatus for providing a secure mode for a device. The method includes obtaining a plurality of parameters for determining a security environment of the device from one or more devices included in the device; determining whether the device is in an insecure environment based on combinations of the obtained plurality of parameters; and, when it is determined that the device is in an insecure environment, controlling the device to operate in the secure mode.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: February 11, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Arnold Yau, Parashuram Chawan
  • Patent number: 10559823
    Abstract: A manganese nickel composite hydroxide which serves as a starting material for positive electrode active materials for secondary batteries, and the secondary battery having low resistance and high output characteristics. A manganese nickel composite hydroxide according to the present invention is represented by general formula (A) Mn1?x?yNixMy(OH)2+?(wherein 0?×?0.27, 0?y?0.05, 0???0.5, and M represents at least one element selected from among Mg, Al, Ca, Ba, Sr, Ti, V, Fe, Cr, Co, Cu, Zr, Nb, Mo and W), and has an SO4 content of 0.90% by weight or less, an Na content of 0.04% by weight or less, a BET specific surface area of from 40 m2/g to 70 m2/g (inclusive), and a value obtained by [(d90-d10)/(average particle diameter)] of 0.90 or less, said value being an index indicating the expanse of the particle size distribution.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: February 11, 2020
    Assignee: SUMITOMO METAL MINING CO., LTD.
    Inventors: Tatsuya Takahashi, Masashi Iwara
  • Patent number: 10560128
    Abstract: Provided are a radio-frequency integrated chip (RFIC) and a wireless communication device including the RFIC. An RFIC configured to receive a carrier aggregated receive signal having at least first and second carrier signals may include first and second carrier receivers configured to generate, from the receive signal, first and second digital carrier signals, respectively. A phase-locked loop (PLL) may output a first frequency signal having a first frequency to the first carrier receiver and the second carrier receiver. The first and second carrier receivers may include first and second analog mixers, respectively, for translating frequencies of the receive signal, using the first frequency signal and the second frequency signal, respectively. Each of the first and second carrier receivers may further include a digital mixer for farther translating the frequencies of the receive signal in the digital domain.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-hyun Oh, Chilun Lo, Barosaim Sung, Jae-hoon Lee, Jong-woo Lee
  • Patent number: 10559592
    Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the memory device includes a substrate and a first alternating conductor/dielectric stack disposed on the substrate and a dielectric layer disposed over the first alternating conductor/dielectric stack. A second alternating conductor/dielectric stack is disposed on the dielectric layer. The NAND memory device includes one or more array common source contacts extending orthogonally with respect to the surface of the substrate through the first layer stack and the second layer stack, wherein at least one of the one or more array common source contacts includes a first conductive contact and a second conductive contact that is disposed over and electrically connected with the first conductive contact.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: February 11, 2020
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jun Liu, Zongliang Huo
  • Patent number: 10560059
    Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: February 11, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroki Shounai, Yoshiki Kogushi
  • Patent number: 10558088
    Abstract: A display substrate motherboard and a display device are provided. The display substrate motherboard includes a plurality of display regions spaced from each other; an assistant support structure between two adjacent display regions of the plurality of display regions, and a height of the assistant support structure increases gradually from an edge of the assistant support structure towards a central location of the assistant support structure along a predetermined direction.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: February 11, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTORNICS TECHNOLOGY CO., LTD.
    Inventors: Cong Tan, Jian Ma, Wenming Ren, Chengyong Zhan
  • Patent number: 10558286
    Abstract: An array substrate, a touch display panel, and a touch display device are provided. The array substrate includes a plurality of pressure sensors. Each pressure sensor includes a first input terminal electrically connected to a first power input terminal, and a second input terminal electrically connected to a second power input terminal. The array substrate also includes a first connection line between the first input terminal of each pressure sensor and the first power input terminal. The first connection line has a first line resistance. In addition, the array substrate includes a second connection line between the second input terminal of each pressure sensor and the second power input terminal. The second connection line has a second line resistance. Further, the array substrate includes a ratio of a resistance of each pressure sensor to a sum of the corresponding first line resistance and second line resistance is the same.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: February 11, 2020
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Liang Liu, Feng Lu, Zaiwen Zhu
  • Patent number: 10558350
    Abstract: A method of changing a user interface (UI), which is used for diagnosis of a target object via a medical device, based on user motion information. The method including obtaining motion information regarding a user; changing the UI based on the obtained motion information regarding the user; and displaying the changed UI.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dae-hyun Ban, Su-jin Kim, Jeong-ho Han
  • Patent number: 10559525
    Abstract: An embedded silicon substrate fan-out type 3D packaging structure, comprising: a silicon substrate; and at least one functional chip, wherein the silicon substrate includes at least one groove, the at least one functional chip is embedded in the at least one groove with a pad surface facing upward, the at least one functional chip is bonded with the at least one groove through a polymer; a front surface of the silicon substrate, the pad surface of the at least one functional chip, and at least one gap between the at least one chip and the at least one groove are covered with a polymer material, and the polymer on pads on the at least one functional chip is opened; at least one conductive through hole is formed on the silicon substrate; and the silicon substrate further includes electrical interconnect structures, a first metal re-wiring and a second metal re-wiring.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: February 11, 2020
    Assignee: HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD.
    Inventor: Daquan Yu
  • Patent number: 10559812
    Abstract: A negative electrode active material for nonaqueous electrolyte secondary batteries including: a particle of negative electrode active material, wherein the particle of negative electrode active material contains a particle of silicon compound containing a silicon compound (SiOx:0.5?x?1.6), on at least a part of a surface of the silicon compound a carbon coating film being formed, and the negative electrode active material contains 2% by mass or less of particle of silicon dioxide and the negative electrode active material contains a silicon dioxide-carbon composite secondary particle containing a plurality of the particles of silicon dioxide and carbon. As a result, the negative electrode active material for nonaqueous electrolyte secondary batteries capable of increasing battery capacity and improving the cycle characteristics and battery initial efficiency is provided.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: February 11, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Takumi Matsuno, Takakazu Hirose, Kohta Takahashi, Masahiro Furuya
  • Patent number: 10560209
    Abstract: Embodiments of the present invention disclose an optical signal transmission method, apparatus, and system. The apparatus includes a short wavelength division multiplexer, a signal processor, a first linear driver, a second linear driver, a first transmitter, and a second transmitter. The signal processor is configured to perform bit rate allocation and code pattern modulation on a received binary signal, to obtain a first electrical signal to be sent to the first linear driver and a second electrical signal to be sent to the second linear driver. It can be learnt that, by implementing the embodiments of the present invention, a quantity of wavelengths transmitted in a multimode optical fiber can be reduced by performing bit rate allocation on a binary signal, thereby reducing interference between channels in the optical fiber for optical signal transmission.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: February 11, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Chuanbiao Wang, Zhenwei Cui, Xiaojun Zeng, Xi Huang
  • Patent number: 10559651
    Abstract: The present invention relates to a method of forming a memory capacitor. A substrate is provided with a plurality of storage node contacts. A patterned supporting structure is formed on the substrate, following by forming a bottom electrode conformally on surface of plural openings in the patterned supporting structure, thereby contacting the storage node contacts. A sacrificial layer is formed in the opening. A soft etching process is performed to remove the bottom electrode on top and partial sidewall of the patterned supporting structure, wherein the soft etching process includes using a fluoride containing compound, a nitrogen and hydrogen containing compound and an oxygen containing compound. The sacrificial layer is completely removed away. A capacitor dielectric layer and a top electrode are formed on the bottom electrode layer.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: February 11, 2020
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Feng-Yi Chang, Fu-Che Lee, Chieh-Te Chen
  • Patent number: 10559668
    Abstract: A semiconductor device of the present invention includes a semiconductor layer of a first conductivity type having a cell portion and an outer peripheral portion disposed around the cell portion, and a surface insulating film disposed in a manner extending across the cell portion and the outer peripheral portion, and in the cell portion, formed to be thinner than a part in the outer peripheral portion.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: February 11, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Yuki Nakano, Ryota Nakamura
  • Patent number: D874795
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: February 11, 2020
    Assignee: Shenzhen fromufoot Co., Ltd
    Inventor: Qingfeng Ma