Patents Assigned to CO
  • Patent number: 12203487
    Abstract: Provided is an axial fan including: an impeller cup including a blade extending in a radial direction; a motor configured to rotate the impeller cup; and a housing accommodating the impeller cup and the motor. The housing includes: a casing portion covering an outer periphery of the impeller cup; a base portion supporting the motor; and a spoke portion connecting the base portion and the casing portion. A vibration restraining portion is provided in a portion, which is connected to the spoke portion, of an outer peripheral portion of the base portion, and the vibration restraining portion has lower stiffness than the other portion of the outer peripheral portion.
    Type: Grant
    Filed: July 7, 2023
    Date of Patent: January 21, 2025
    Assignee: SANYO DENKI CO., LTD.
    Inventors: Yoshihisa Yamazaki, Masashi Miyazawa
  • Patent number: 12205819
    Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor includes: a first source and a first drain separated by a first distance, a first semiconductor structure disposed between the first source and first drain, a first gate electrode disposed over the first semiconductor structure, and a first dielectric structure disposed over the first gate electrode. The first dielectric structure has a lower portion and an upper portion disposed over the lower portion and wider than the lower portion. The second transistor includes: a second source and a second drain separated by a second distance greater than the first distance, a second semiconductor structure disposed between the second source and second drain, a second gate electrode disposed over the second semiconductor structure, and a second dielectric structure disposed over the second gate electrode. The second dielectric structure and the first dielectric structure have different material compositions.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: January 21, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Chieh Su, Zhi-Chang Lin, Ting-Hung Hsu, Jia-Ni Yu, Wei-Hao Wu, Yu-Ming Lin, Chih-Hao Wang
  • Patent number: 12203430
    Abstract: An engine is equipped with an engine body, a turbocharger, an exhaust gas purifier, an exhaust communication pipe. The turbocharger is connected to the engine body. The exhaust gas purifier purifies exhaust gas discharged from the turbocharger. The exhaust communication pipe connects the turbocharger with the exhaust gas purifier. The exhaust communication pipe includes: a first connection member that is connected to the turbocharger, and a second connection member that connects the first connection member with the exhaust gas purifier. A downstream end portion of the first connection member has an inner peripheral face having a cross-section of a circular shape. An upstream end portion of the first connection member has an inner peripheral face having a cross-section of an abnormal-shape that is different from the inner peripheral face of the downstream end portion.
    Type: Grant
    Filed: April 25, 2024
    Date of Patent: January 21, 2025
    Assignee: YANMAR HOLDINGS CO., LTD.
    Inventor: Shinsuke Kasazaki
  • Patent number: 12205853
    Abstract: A semiconductor device includes a semiconductor die. The semiconductor die includes a device layer, an interconnect layer over the device layer, a conductive pad over the interconnect layer, a conductive seed layer directly on the conductive pad, and a passivation layer encapsulating the conductive pad and the conductive seed layer. The conductive pad is between the interconnect layer and the conductive seed layer.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: January 21, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsien-Wen Liu, Hsien-Wei Chen
  • Patent number: 12206382
    Abstract: A bulk acoustic wave (BAW) resonator includes a bottom substrate, a piezoelectric layer disposed above the bottom substrate, a cap wafer disposed above the piezoelectric layer, a top electrode disposed on the piezoelectric layer, a bottom electrode disposed below the piezoelectric layer, a first pad metal layer disposed on and electrically connected to the top electrode. a second pad metal layer disposed on and electrically connected to the bottom electrode, a top bonding layer disposed below the cap wafer, for bonding the cap wafer with the piezoelectric layer; and a bond contacting layer disposed between the top bonding layer and each one of the first pad metal layer and the second pad metal layer.
    Type: Grant
    Filed: December 18, 2023
    Date of Patent: January 21, 2025
    Assignee: Shenzhen Newsonic Technologies Co., Ltd.
    Inventor: Weiwei Hu
  • Patent number: 12202869
    Abstract: A method of inhibiting myostatin signaling via a myostatin splice variant-derived protein is provided. The protein and an expression system thereof are applicable to therapy for diseases in which myostatin is involved.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: January 21, 2025
    Assignee: KNC LABORATORIES CO., LTD.
    Inventors: Masafumi Matsuo, Kosuke Okazaki, Kazuhiro Maeta
  • Patent number: 12203622
    Abstract: A light distribution controller controls a light distribution variable lamp including a plurality of pixels arranged in an array. The processor executes the software program to generate at least one image defining the light distribution of the light distribution variable lamp, and writes the image in the volatile memory. A monitoring microcontroller detects an abnormality of the processor. A hardware logic circuit (i) generates a light distribution image data to be output to the light distribution variable lamp on the basis of at least one image written in the volatile memory in a normal state of the processor, and (ii) generates a light distribution image data on the basis of the generated auxiliary image without depending on the processor in an abnormal state of the processor.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: January 21, 2025
    Assignee: KOITO MANUFACTURING CO., LTD.
    Inventors: Mitsuharu Mano, Hirotaka Sawada, Naoki Kawabata, Keisuke Inagaki
  • Patent number: 12202240
    Abstract: A solar panel disassembling apparatus according to an embodiment of the present disclosure separates a glass plate of a solar panel and a film layer bonded to the glass plate from each other. The solar panel disassembling apparatus includes a supply module that stands and fixes the solar panel such that a bond line between the glass plate and the film layer is exposed upward and downward and that moves the solar panel in a parallel direction parallel to a bonding surface between the glass plate and the film layer, and a wire-shaped cutting blade that is disposed in front of the solar panel in a movement direction of the solar panel to have a distance from the supply module, is disposed in parallel to the bonding surface, and separates the glass plate and the film layer from each other.
    Type: Grant
    Filed: June 8, 2022
    Date of Patent: January 21, 2025
    Assignee: WON KWANG S&T CO., LTD.
    Inventors: Sang Hun Lee, Jun Kee Kim, Cheong Min Noh, Geun Sik Cho, Do Yun Lee
  • Patent number: 12203172
    Abstract: The present invention relates to an aqueous dispersion as a concentrate for the activation stage of phosphating of metal surfaces, containing a dispersed particulate constituent and a thickener, the particulate constituent containing, in addition to dispersed inorganic compounds of polyvalent metal cations, polymeric organic compounds as dispersing agents which are composed at least partially of styrene and/or an ?-olefin having no more than 5 carbon atoms and maleic acid, its anhydride and/or its imide, and which additionally comprise polyoxyalkylene units. The aqueous dispersion is further characterized by a D50 value above 10 ?m. The present invention also relates to a method for anti-corrosion pretreatment of the surfaces of a metal material, in particular for zinc phosphating.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: January 21, 2025
    Assignee: Henkel AG & Co. KGaA
    Inventors: Christina Angenendt, Jan-Willern Brouwer, Hendrik Bussmann, Franz-Adolf Czika, Ralf Posner, Sebastian Sinnwell, Kristof Wapner
  • Patent number: 12204710
    Abstract: A novel input device that is highly convenient or reliable is provided. A novel input/output device that is highly convenient or reliable is provided. A semiconductor device is provided. The present inventors have reached an idea of a structure including a plurality of conductive films configured to be capacitively coupled to an approaching object, a driver circuit that selects a conductive film from a plurality of conductive films in a predetermined order, and a sensor circuit having a function of supplying a search signal and a sensing signal.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: January 21, 2025
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hajime Kimura, Shunpei Yamazaki
  • Patent number: 12202650
    Abstract: [Object] To provide a synthetic resin cap of a structure that is further improved in convenience when drinking while suppressing falling or loss of the cap when a container is opened. [Solving Means] A synthetic resin cap as a specific example of the present invention has a tamper-evident band to be fitted on an outer peripheral surface of a container mouth portion of a container, and a cap main body having a skirt wall and a top plate, and including, in the skirt wall, a fixing rib coupled with the tamper-evident band via a weakened portion and a strap portion and extending to a radially outer side of the skirt wall. The fixing rib is formed from a first inclined portion that flares downwards, and a protrusion portion that is disposed below the first inclined portion.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: January 21, 2025
    Assignees: KABUSHIKI KAISHA YAKULT HONSHA, NIPPON CLOSURES CO., LTD
    Inventors: Shinji Omori, Masaharu Ezaki, Reiko Kohara
  • Patent number: 12202731
    Abstract: Provided is a method of preparing a silicon composite. The method of preparing a silicon composite includes forming a silicon solution by wet-grinding a silicon raw material; forming silicon fine powder by spray-drying the silicon solution; disintegrating the silicon fine powder; forming a dispersion by coating the silicon fine powder with a first pitch; forming a first composite by coating the dispersion with a second pitch; forming a second composite by carbonizing the first composite; and classifying the second composite according to a preset particle size reference.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: January 21, 2025
    Assignee: KOREA METAL SILICON CO., LTD.
    Inventors: Jong Oh Choi, Min Sun Kim, Jong Sik Yoo
  • Patent number: 12206402
    Abstract: A control unit has an input with a positive and negative connectors. The control unit also includes an output and with an electronic switch. The switch has a first connector, a second connector and a control connector, and has an on-state resistance between its first and second connector that depends on a control voltage at the control connector of the switch. The first connector is connected to the connector for the positive potential of the input, the second connector is connected to the connector for the positive potential of the output, and the control connector is connected to a trigger circuit. A second controllable switch is also included with a first connector connected to the second connector of the first switch, a second connector connected to the control connector of the first switch, and a control connector connected to the connector for the negative potential of the input.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: January 21, 2025
    Assignee: Hella GmbH & Co. KGaA
    Inventors: Jan Frederik Buthke, Jan Schmaeling, Martin Strauch
  • Patent number: 12206541
    Abstract: This application provides a communication method and an apparatus, so that a terminal device and a network device can determine, based on a frequency domain position of each resource element in a second resource element set, a transmit sequence of each uplink transmit port on the second resource element set, to send and receive an uplink reference signal on a non-uniform pilot resource.
    Type: Grant
    Filed: May 26, 2023
    Date of Patent: January 21, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shijie Cai, Kunpeng Liu
  • Patent number: 12207174
    Abstract: This disclosure provides communications methods and apparatuses. One method comprises: receiving, by a first entity of an adaptation layer in a network node, a data packet sent by an entity of a lower protocol layer of the adaptation layer, wherein the data packet comprising an adaptation layer header and an adaptation layer payload; and processing the data packet in response to determining whether the network node is a destination node that the data packet is routed to at the adaptation layer.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: January 21, 2025
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yuanping Zhu, Zhenzhen Cao, Mingzeng Dai, Yibin Zhuo, Jing Liu
  • Patent number: 12203821
    Abstract: An embodiment may provide a sensing device comprising: a stator comprising stator teeth; and a rotor comprising magnets, wherein: the stator teeth comprise a first stator tooth and a second stator tooth arranged to overlap the first stator tooth in the radial direction from the center of the stator; the first stator tooth comprises multiple first teeth and multiple third teeth, and the second stator tooth comprises multiple second teeth; one of the multiple first teeth is arranged to overlap one of the multiple second teeth in the radial direction; and the magnets are disposed between the multiple first teeth and the multiple third teeth, respectively.
    Type: Grant
    Filed: February 9, 2024
    Date of Patent: January 21, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Sung Wook Byun
  • Patent number: 12206374
    Abstract: A power amplifying circuit includes a single-ended amplifier, a differential amplifier, a first balun transformer, a second balun transformer, and a first switching circuit. The single-ended amplifier operates in a first mode and a second mode different from the first mode. The differential amplifier operates in the second mode. The first balun transformer converts an unbalanced output signal from the single-ended amplifier into a differential signal and outputs the differential signal to the differential amplifier. The second balun transformer converts a balanced output signal from the differential amplifier into an unbalanced output signal. The first switching circuit outputs the unbalanced output signal from the single-ended amplifier in the first mode and outputs the unbalanced output signal from the second balun transformer in the second mode.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: January 21, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hisanori Namie, Satoshi Goto, Tomoaki Sato
  • Patent number: 12201237
    Abstract: A sealing cover for GN pans, including a pan cover body and a sealing ring that is arranged on the pan cover body; surrounding edges of the pan cover body extend outward to form a pan edge, which is provided with a first clamping groove, and a second clamping groove is arranged at the pan cover body, an outer wall of the sealing ring extends outward to form a first clamping edge, and an inner wall extends inward to form a second clamping edge, the first and second clamping edge are respectively embedded in the first and second clamping groove. Thus, the sealing ring is ensured to be tightly connected with the pan cover body, and relative movement between the sealing ring and the pan cover body is avoided, forming an integrated structure of the sealing ring and the pan cover body and to ensure the sealing performance.
    Type: Grant
    Filed: July 16, 2024
    Date of Patent: January 21, 2025
    Assignee: Zhongshan Jiabao Daily Products Co., Ltd
    Inventor: Shengbin Cai
  • Patent number: D1058507
    Type: Grant
    Filed: August 6, 2024
    Date of Patent: January 21, 2025
    Assignee: Shenzhen Zhongyuan Network Technology Co., Ltd.
    Inventor: Shunan Wu
  • Patent number: D1058932
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: January 21, 2025
    Assignee: Church & Dwight Co., Inc.
    Inventors: David Stowers, Lana Rascionato