Abstract: A lithography film stack applied to an immersion lithography process includes a photoresist, a wavelength adjusting layer and a top coating layer. The photoresist is disposed on a substrate. The wavelength adjusting layer is disposed on the photoresist. The top coating layer is disposed on the wavelength adjusting layer. A refractive index of the wavelength adjusting layer is greater than a refractive index of the top coating layer and a refractive index of an immersion fluid of the immersion lithography process.

Abstract: The embodiments relate to a heat shrinkable film and a process for regenerating a polyester container using the same. The heat shrinkable film comprises a copolymerized polyester resin comprising a diol component and a dicarboxylic acid component and has a heat shrinkage rate of 30% or more in the main shrinkage direction upon thermal treatment at a temperature of 80° C. for 10 seconds, a melting point of 190° C. or higher as measured by differential scanning calorimetry, and a peak temperature (Tp) of 95° C. to 115° C. as measured in the endothermic and exothermic curve (heat flow) by differential scanning calorimetry. It not only solves the environmental problem by improving the recyclability of the polyester container, but also is capable of enhancing the yield and productivity.

Abstract: What is presented and described is a method for avoiding the microbial attack of a cleaning apparatus, in particular a cleaning apparatus for a metering system, wherein the cleaning apparatus has at least one mechanical cleaning element with at least one cleaning surface, wherein the method is characterized in that the at least one cleaning surface of the at least one mechanical cleaning element is exposed, at least temporarily, to an oxidizing agent. The present invention further relates to a method for cleaning a metering system, in particular for a dispersion, especially a paint-metering system, to a cleaning apparatus, and to a metering system.

Abstract: An antenna stack structure according to an embodiment includes an antenna substrate layer, an antenna unit disposed on one surface of the antenna substrate layer and including a radiator and an antenna pad, and a pad ground and an insulating layer disposed at the same level on an opposite surface of the antenna substrate layer facing the one surface. The antenna pad is superimposed over the pad ground in a thickness direction. Radiation properties can be improved utilizing the antenna pad.

Abstract: An inverter is disposed adjacent to one end of a motor in a rotational axis direction. The inverter includes a plurality of power modules each including a switching element, a smoothing capacitor, busbars that connect the power modules to the smoothing capacitor, and a thin case that accommodates these components. The plurality of power modules are disposed at the periphery of the smoothing capacitor and arranged in the circumferential direction. The busbars are formed to extend in the circumferential direction. An inner edge portion of each of the busbars connected to a terminal of the smoothing capacitor has an arc shape or a circular shape.

Abstract: The invention relates to the technical field of vehicle charging, and particularly provides a vehicle charging port mounting assembly and a vehicle. The invention aims to solve the problem that existing charging port components have a poor design of mounting structure and thus cannot well meet the usage requirements. To this end, the vehicle charging port mounting assembly of the invention comprises a body side outer panel, a charging port component, a charging port mounting component, a rear wheel cover outer panel and a rear wheel cover outer panel reinforcing plate, wherein the charging port mounting component comprises a mounting bracket and an accommodation support member which is provided with an accommodation chamber, the mounting bracket being disposed in the accommodation chamber and fixedly connected to the accommodation support member, and the accommodation support member being disposed between the body side outer panel and the rear wheel cover outer panel.

Abstract: A method and an apparatus for obtaining an extended depth of field image, where the method includes: determining a target focal length range based on an initial focal length, where the target focal length range includes the initial focal length; obtaining a plurality of images of a photographed object for a plurality of focal lengths in the target focal length range; and registering and fusing the plurality of images to obtain an extended depth of field image. The target focal length range of concern to a user is selected based on the initial focal length, such that there is no need to obtain images of all focal lengths of a lens, a quantity of obtained images and processing time of registration and fusion can be reduced.

Abstract: When successfully establishing a communication connection to an electronic device, the terminal device displays a first query pop-up window, to query a user whether to allow to open a hotspot to the electronic device. When receiving an instruction that allows to open the hotspot to the electronic device, the terminal device closes the first query pop-up window, and displays a second query pop-up window. The terminal device obtains a program indication set submitted by the user by using the second query pop-up window. A program indication is used to indicate a target program that is specified by the user to be disabled. The terminal device sends a processing instruction to the electronic device, to indicate the electronic device to connect to the hotspot after the electronic device disables all target programs indicated by the program indication set.

Abstract: The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 ?m and less than 3 ?m, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 ?m and less than 15 ?m, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 ?m and less than or equal to 100 ?m, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.

Abstract: A lamp includes light sources, and MFLs corresponding to the light sources, each light source is configured to output light along an optical axis, each MFL is configured to receive the light output from the respective light source and to transmit the received light, and the MFLs include a central MFL, to which a first light output from a central light source is input, and from which the first light is output to form a central part of a light distribution pattern, a peripheral MFL, to which a second light output from a peripheral light source is input, and from which the second light is output to form a peripheral part of the light distribution pattern, wherein an intensity of illumination of the peripheral part of the light distribution pattern is lower than an intensity of illumination of the central part of the light distribution pattern.

Abstract: A system on a chip may include a codec module configured to receive an image including a plurality of first pixel data and output a plurality of second pixel data through a system bus. The codec module comprises at least one (M+N) bit logic circuit including M bit logic and N bit logic. The codec module is configured to operate in a first mode where the (M+N) bit logic circuit performs a dithering operation on the first pixel data of (M+N) bits and generates the second pixel data including at least M bits. The codec module is configured to operate in a second mode where the M-bit logic selectively operates and outputs the second pixel data of M bits.

Abstract: A filling and covering machine for centrifuge tubes with tethered caps includes a conveying device, a cap-flapping device, a filling device, and a cap-pressing device. The cap-flapping device has an upper planar surface and a cap-guiding member having a starting end portion, an ending end portion that is opposite to the starting end portion, and a guiding surface extending from the starting end portion to the ending end portion, and cooperates with the upper planar surface to define an included angle therebetween decreasing gradually from the starting end portion to the ending end portion to guide a cap of each of the centrifuge tubes with tethered caps toward a tube body thereof.

Abstract: Provided in the present disclosure are a display panel and a display device. The display panel comprises: a base substrate; multiple contact electrodes, arranged on the base substrate in a non-display region of the display panel; an inorganic film layer, arranged on the side of the contact electrodes in proximity to the base substrate; the inorganic film layer comprising an inorganic material; an organic film layer, arranged on the side of the contact electrodes away from the base substrate; and a barrier layer, arranged on the side of the organic film layer away from the base substrate; the barrier layer comprising an inorganic material; and, the organic film layer being provided with openings in at least some gaps between adjacent contact electrodes.

Abstract: A circuit board may include an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer and the circuit pattern, the buffer layer comprising carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and metal atoms. The ratio of the carbon atoms to the metal atoms ((carbon atom/copper atom)*100) is within a range of 5-7; the ratio of the nitrogen atoms to the metal atoms ((nitrogen atom/copper atom)*100) is within a range of 1.5-7; the ratio of the oxygen atoms to the metal atoms ((oxygen atom/copper atom)*100) is within a range of 1.1-1.9; and the ratio of the silicon atoms to the metal atoms ((silicon atom/copper atom)*100) is within a range of 0.5-0.9; and the ratio of the sulfur atoms to the metal atoms ((sulfur atom/copper atom)*100) is within a range of 0.5-1.5.